Compact led package with reflectivity layer

ABSTRACT

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

This application is a continuation in part of and claims the benefit ofU.S. patent application Ser. No. 13/957,290, filed on Aug. 1, 2013,which is a continuation-in-part of U.S. patent application Ser. No.13/770,389, filed on Feb. 19, 2013, which is a continuation-in-part ofand claims the benefit of U.S. patent application Ser. No. 13/649,067,and U.S. patent application Ser. No. 13/649,052, both of which werefiled on Oct. 10, 2012, and both of which claim the benefit of U.S.Provisional Patent Application Ser. No. 61/658,271, filed on Jun. 11,2012, U.S. Provisional Patent Application Ser. No. 61/660,231, filed onJun. 15, 2012, and U.S. Provisional Patent Application Ser. No.61/696,205, filed on Sep. 2, 2012. Each of the applications cited inthis paragraph are incorporated by reference as if fully set forthherein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention pertains to solid state light emitters and in particularto compact light emitting diode (LED) packages with one or more LEDs,and an encapsulant comprising planar and/or curved surfaces, and areflectivity layer to enhance light extraction.

2. Description of the Related Art

Incandescent or filament-based lamps or bulbs are commonly used as lightsources for both residential and commercial facilities. However, suchlamps are highly inefficient light sources, with as much as 95% of theinput energy lost, primarily in the form of heat or infrared energy. Onecommon alternative to incandescent lamps, so-called compact fluorescentlamps (CFLs), are more effective at converting electricity into lightbut require the use of toxic materials which, along with its variouscompounds, can cause both chronic and acute poisoning and can lead toenvironmental pollution. One solution for improving the efficiency oflamps or bulbs is to use solid state devices such as light emittingdiodes (LED or LEDs), rather than metal filaments, to produce light.

Light emitting diodes generally comprise one or more active layers ofsemiconductor material sandwiched between oppositely doped layers. Whena bias is applied across the doped layers, holes and electrons areinjected into the active layer where they recombine to generate light.Light is emitted from the active layer and from various surfaces of theLED.

In order to use an LED chip in a circuit or other like arrangement, itis known to enclose an LED chip in a package to provide environmentaland/or mechanical protection, color selection, light focusing and thelike. An LED package also, includes electrical leads, contacts or tracesfor electrically connecting the LED package to an external circuit. In atypical LED package 10 illustrated in FIG. 1, a single LED chip 12 ismounted on a reflective cup 13 by means of a solder bond or conductiveepoxy. One or more wire bonds 11 connect the ohmic contacts of the LEDchip 12 to leads 15A and/or 15B, which may be attached to or integralwith the reflective cup 13. The reflective cup may be filled with anencapsulant material 16 which may contain a wavelength conversionmaterial such as a phosphor. Light emitted by the LED at a firstwavelength may be absorbed by the phosphor, which may responsively emitlight at a second wavelength. The entire assembly is then encapsulatedin a clear protective resin 14, which may be molded in the shape of alens to collimate the light emitted from the LED chip 12. While thereflective cup 13 may direct light in an upward direction, opticallosses may occur when the light is reflected (i.e. some light may beabsorbed by the reflective cup due to the less than 100% reflectivity ofpractical reflector surfaces). In addition, heat retention may be anissue for a package such as the package 10 shown in FIG. 1, since it maybe difficult to extract heat through the leads 15A, 15B.

A conventional LED package 20 illustrated in FIG. 2 may be more suitedfor high power operations which may generate more heat. In the LEDpackage 20, one or more LED chips 22 are mounted onto a carrier such asa printed circuit board (PCB) carrier, substrate or submount 23. A metalreflector 24 mounted on the submount 23 surrounds the LED chip(s) 22 andreflects light emitted by the LED chips 22 away from the package 20. Thereflector 24 also provides mechanical protection to the LED chips 22.One or more wirebond connections 27 are made between ohmic contacts onthe LED chips 22 and electrical traces 25A, 25B on the submount 23. Themounted LED chips 22 are then covered with an encapsulant 26, which mayprovide environmental and mechanical protection to the chips while alsoacting as a lens. The metal reflector 24 is typically attached to thecarrier by means of a solder or epoxy bond.

LED chips, such as those found in the LED package 20 of FIG. 2 can becoated by conversion material comprising one or more phosphors, with thephosphors absorbing at least some of the LED light. The LED chip canemit a different wavelength of light such that it emits a combination oflight from the LED and the phosphor. The LED chip(s) can be coated witha phosphor using many different methods, with one suitable method beingdescribed in U.S. patent application Ser. Nos. 11/656,759 and11/899,790, both to Chitnis et al. and both entitled “Wafer LevelPhosphor Coating Method and Devices Fabricated Utilizing Method”.Alternatively, the LEDs can be coated using other methods such aselectrophoretic deposition (EPD), with a suitable EPD method describedin U.S. patent application Ser. No. 11/473,089 to Tarsa et al. entitled“Close Loop Electrophoretic Deposition of Semiconductor Devices”.

Another conventional LED package 30 shown in FIG. 3 comprises an LED 32on a submount 34 with a hemispheric lens 36 formed over it. The LED 32can be coated by a conversion material that can convert all or most ofthe light from the LED. The hemispheric lens 36 is arranged to minimizetotal internal reflection of light. The lens is made relatively largecompared to the LED 32 so that the LED 32 approximates a point lightsource under the lens. As a result, the amount of LED light that reachesthe surface of the lens 36 is maximized to maximize the amount of lightthat emits from the lens 36 on the first pass. This can result inrelatively large devices where the distance from the LED to the edge ofthe lens is maximized, and the edge of the submount can extend outbeyond the edge of the encapsulant. Further, these devices generallyproduce a Lambertian emission pattern that is not always ideal for wideemission area applications. In some conventional packages the emissionprofile can be approximately 120 degrees full width at half maximum(FWHM).

Lamps have also been developed utilizing solid state light sources, suchas LEDs, in combination with a conversion material that is separatedfrom or remote to the LEDs. Such arrangements are disclosed in U.S. Pat.No. 6,350,041 to Tarsa et al., entitled “High Output Radial DispersingLamp Using a Solid State Light Source.” The lamps described in thispatent can comprise a solid state light source that transmits lightthrough a separator to a disperser having a phosphor. The disperser candisperse the light in a desired pattern and/or changes its color byconverting at least some of the light to a different wavelength througha phosphor or other conversion material. In some embodiments theseparator spaces the light source a sufficient distance from thedisperser such that heat from the light source will not transfer to thedisperser when the light source is carrying elevated currents necessaryfor room illumination. Additional remote phosphor techniques aredescribed in U.S. Pat. No. 7,614,759 to Negley et al., entitled“Lighting Device.”

SUMMARY OF THE INVENTION

The present invention is generally directed to emitter or LED packagesthat are compact and efficiently emit light, and can compriseencapsulants with planar surfaces that refract and/or reflect lightwithin the package encapsulant. In some embodiments, the packages canalso comprise a submount with one LED, while other embodiments cancomprise a plurality of LEDs. In the single LED embodiments, a blanketconversion material layer can cover the LED, and in multiple LEDembodiments the blanket conversion material layer can be on one or moreof the LEDs. The blanket conversion material may also cover at leastpart of the submount. The encapsulant can be on the submount, over theLEDs, and over at least part of the blanket conversion material. Some ofthe light reflected within the encapsulant, due, for example, to totalinternal reflection from planar or otherwise shaped encapsulant surface,will reach the conversion material, where it may be scattered orabsorbed and converted and then emitted omnidirectionally. This allowsfor reflected light to now escape from the encapsulant. This allows forefficient emission and a broader emission profile, for example whencompared to conventional packages with hemispheric encapsulants orlenses.

In embodiments, the LED packages can be provided reflective layers toenhance light package light extraction. The reflective layers can bearranged to reflect light that otherwise might encounter light absorbingsurfaces. These surfaces can absorb some or all of the light, which canlead to a reduction in package emission efficiency.

One embodiment of an emitter package according to the present inventioncomprises one or more of solid state light sources on a surface of asubmount. A reflective layer is included on the same surface of thesubmount with an encapsulant included over the one or more solid statelight sources. An edge of the submount, the reflective layer and theencapsulant form at least a portion of an edge of the package.

Another embodiment of an emitter package according to the presentinvention comprises one or more of solid state light sources on asurface of a submount. A reflective layer is included on the samesurface of the submount from the edges of the light sources toward theedge of the submount. An encapsulant is included over the solid statelight sources, reflective layer and submount, with the encapsulanthaving one or more planar surface

Another embodiment of an emitter package according to the presentinvention comprises one or more light emitting diodes (LEDs) on asurface of a submount with a conversion material layer over the LEDs. Areflective layer is included on the surface of the submount and coveringsubstantially all of the surface not covered by the one or more LEDs.

Still another embodiment of an emitter package according to the presentinvention comprises one or more LEDs mounted on a submount with areflective layer on the top of the submount not covered by the LEDs. Anencapsulant is included on the submount, wherein the encapsulantcomprises a curved upper surface and one or more planar side surfaceshaving a curved edge.

These and other aspects and advantages of the invention will becomeapparent from the following detailed description and the accompanyingdrawings which illustrate by way of example the features of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a sectional view of one embodiment of a prior art LEDpackage;

FIG. 2 shows a sectional view of another embodiment of a prior art LEDpackage;

FIG. 3 shows a sectional view of still another embodiment of a prior artLED package;

FIG. 4 is a top perspective view of one embodiment of an LED packageaccording to the present invention;

FIG. 5 is bottom perspective view of the LED package shown in FIG. 4;

FIG. 6 is a side elevation view of the LED package shown in FIG. 4;

FIG. 7 is another side elevation view of the LED package shown in FIG.4;

FIG. 8 is a top view of the LED package shown in FIG. 4;

FIG. 9 is a bottom view of the LED package shown in FIG. 4;

FIG. 10 is another top view of the LED package shown in FIG. 4 showingone embodiment of its dimensions;

FIG. 11 is another side view of the LED package shown in FIG. 4 showingone embodiment of its dimensions;

FIG. 12 is another top view of the LED package shown in FIG. 4 showingone embodiment of its dimensions;

FIG. 13 is another perspective view of the LED package shown in FIG. 4;

FIG. 14 shows one embodiment of a solder pad that can be used with LEDpackages according to the present invention;

FIG. 15 shows one embodiment of a trace layout that can be used with LEDpackages according to the present invention;

FIG. 16 is a top view of a conventional LED carrier tape;

FIG. 17 is a sectional view of one embodiment of and LED packageaccording to the present invention;

FIG. 18 is an emission profile graph for one embodiment of an LEDpackage according to the present invention;

FIG. 19 is a color temperature profile graph for one embodiment of anLED package according to the present invention;

FIG. 20 is a top perspective view of one embodiment of an LED packageaccording to the present invention;

FIG. 21 is bottom perspective view the LED package shown in FIG. 20;

FIGS. 22 through 25 are side elevation views of the LED package shown inFIG. 20;

FIG. 26 is a top view of the LED package shown in FIG. 20;

FIG. 27 is a bottom view of the LED package shown in FIG. 20;

FIG. 28 is a top perspective view of one embodiment of an LED packageaccording to the present invention;

FIG. 29 is a bottom perspective view the LED package shown in FIG. 28;

FIGS. 30 through 33 are side elevation views of the LED package shown inFIG. 28;

FIG. 34 is a top view of the LED package shown in FIG. 28;

FIG. 35 is a bottom view of the LED package shown in FIG. 28;

FIG. 36 is a top view of one embodiment of a submount according to thepresent invention;

FIG. 37 is a top view of one embodiment of a submount according to thepresent invention;

FIG. 38 is a top view of another submount according to the presentinvention;

FIG. 39 is a top view of another submount according to the presentinvention;

FIG. 40 is a top view of another submount according to the presentinvention;

FIG. 41 is a top view of still another submount according to the presentinvention;

FIG. 42 is a top view of one embodiment of an encapsulant mold accordingto the present invention;

FIG. 43 is a top view of still another embodiment of an LED packageaccording to the present invention;

FIG. 44 is a side view of the LED package shown in 43;

FIG. 45 is a bottom view of the LED package shown in FIG. 43;

FIG. 46 is a perspective view the LED package shown in FIG. 43;

FIG. 47 is a graph showing performance characteristics for LED basedfluorescent replacement tubes according to the present invention;

FIG. 48 is another graph showing performance characteristics for LEDbased fluorescent replacement tubes according to the present invention;

FIG. 49 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 50 is a side view of the LED package shown in FIG. 49;

FIG. 51 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 52 is a side view of the LED package shown in FIG. 51;

FIG. 53 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 54 is a side view of the LED package shown in FIG. 53;

FIG. 55 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 56 is a side view of the LED package shown in FIG. 55;

FIG. 57 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 58 is a side view of the LED package shown in FIG. 57;

FIG. 59 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 60 is a side view of the LED package shown in FIG. 59;

FIG. 61 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 62 is a side view of the LED package shown in FIG. 61;

FIG. 63 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 64 is a side view of the LED package shown in FIG. 63;

FIG. 65 is a top perspective view of one embodiment of an LED packageaccording to the present invention;

FIG. 66 is a bottom perspective view of the LED package shown in FIG.65;

FIG. 67 is a top view of the LED package shown in FIG. 65;

FIG. 68 is another side elevation view of the LED package shown in FIG.65;

FIG. 69 is a bottom view of the LED package shown in FIG. 65;

FIG. 70 is a side view of the LED package shown in FIG. 65;

FIG. 71 is another emission profile graph for an LED package accordingto the present invention;

FIG. 72 is a color temperature profile graph for one embodiment of anLED package according to the present invention;

FIG. 73 is a graph showing luminous flux of different LED packagesaccording to the present invention at different input current;

FIG. 74 is a graph showing efficacy of different LED packages accordingto the present invention at different input current;

FIG. 75 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 76 is a bottom perspective view of the LED package shown in FIG.75;

FIG. 77 is a top view of the LED package shown in FIG. 75;

FIG. 78 is another side elevation view of the LED package shown in FIG.75;

FIG. 79 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 80 is a bottom perspective view of the LED package shown in FIG.79;

FIG. 81 is a top view of the LED package shown in FIG. 79;

FIG. 82 is a side elevation view of the LED package shown in FIG. 79;

FIG. 83 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 84 is a bottom perspective view of the LED package shown in FIG.83;

FIG. 85 is a top view of the LED package shown in FIG. 83;

FIG. 86 is a side elevation view of the LED package shown in FIG. 83;

FIG. 87 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 88 is a bottom perspective view of the LED package shown in FIG.87;

FIG. 89 is a top view of the LED package shown in FIG. 87;

FIG. 90 is a side elevation view of the LED package shown in FIG. 87;

FIG. 91 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 92 is a top view of die attach pads in the LED package shown inFIG. 91;

FIG. 93 is a top view of the solder pads in the LED package shown inFIG. 91;

FIG. 94 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 95 is a top view of die attach pads in the LED package shown inFIG. 94;

FIG. 96 is a top view of another submount according to the presentinvention;

FIG. 97 is a top view of another submount according to the presentinvention;

FIG. 98 is a sectional view of one embodiment of a mixing chamberaccording to the present invention;

FIG. 99 is top perspective view of another embodiment of an LED packageaccording to the present invention;

FIG. 100 is a side elevation view of the LED package shown in FIG. 99;

FIG. 101 is top perspective view of another embodiment of an LED packageaccording to the present invention;

FIG. 102 is a side elevation view of the LED package shown in FIG. 101;

FIG. 103 is top perspective view of another embodiment of an LED packageaccording to the present invention;

FIG. 104 is a side elevation view of the LED package shown in FIG. 103;

FIG. 105 is top perspective view of another embodiment of an LED packageaccording to the present invention;

FIG. 106 is a side elevation view of the LED package shown in FIG. 105;

FIG. 107 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 108 is a side elevation view of the LED package shown in FIG. 107;

FIG. 109 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 110 is a side elevation view of the LED package shown in FIG. 109;

FIG. 111 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 112 is a side elevation view of the LED package shown in FIG. 111;

FIG. 113 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 114 is a side elevation view of the LED package shown in FIG. 113;

FIG. 115 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 116 is a side elevation view of the LED package shown in FIG. 115;

FIG. 117 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 118 is a side elevation view of the LED package shown in FIG. 117;

FIG. 119 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 120 is a top view of the LED package shown in FIG. 119;

FIG. 121 is a bottom view of the LED package shown in FIG. 119;

FIG. 122 is a front elevation view of the LED package shown in FIG. 119;

FIG. 123 is a back elevation view of the LED package shown in FIG. 119;

FIG. 124 is a side elevation view of the LED package shown in FIG. 119;

FIG. 125 is the opposite side elevation view of the LED package shown inFIG. 119;

FIG. 126 shows top and elevation views for a series of LED packagesaccording to the present invention;

FIG. 127 is a graph showing emission profiles for two LED packagesaccording to the present invention;

FIG. 128 is a graph showing color temperature at different viewingangles for two LED packages according to the present invention;

FIG. 129 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 130 is a top view of the LED package shown in FIG. 129;

FIG. 131 is a front elevation view of the LED package shown in FIG. 129;

FIG. 132 is a side elevation view of the LED package shown in FIG. 129;

FIG. 133 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 134 is a top view of the LED package shown in FIG. 133;

FIG. 135 is a bottom view of the LED package shown in FIG. 133;

FIG. 136 is a front elevation view of the LED package shown in FIG. 133;

FIG. 137 is a back elevation view of the LED package shown in FIG. 133;

FIG. 138 is a side elevation view of the LED package shown in FIG. 133;

FIG. 139 is the opposite side elevation view of the LED package shown inFIG. 133;

FIG. 140 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 141 is a top view of the LED package shown in FIG. 140;

FIG. 142 is a front elevation view of the LED package shown in FIG. 140;

FIG. 143 is a side elevation view of the LED package shown in FIG. 140;

FIG. 144 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 145 is a bottom perspective view the LED package shown in FIG. 144;

FIG. 146 is a side elevation view of the LED package shown in FIG. 144;

FIG. 147 is sectional view of the LED package shown in FIG. 144, takenalong section lines 147-147;

FIG. 148 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 149 is a bottom perspective view the LED package shown in FIG. 148;

FIG. 150 is a side elevation view of the LED package shown in FIG. 148;

FIG. 151 is a sectional view of the LED package shown in FIG. 148, takenalong section lines 151-151;

FIG. 152 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 153 is a top view the LED package shown in FIG. 152;

FIG. 154 is a section view of the LED package shown in FIG. 152 takenalong section lines 154-154;

FIG. 155 is a bottom view of the LED package shown in FIG. 152;

FIG. 156 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 157 is a top view of the LED package shown in FIG. 156;

FIG. 158 is a bottom view of the LED package shown in FIG. 156;

FIG. 159 is a sectional view of the LED package shown in FIG. 156, takenalong section lines 159-159;

FIG. 160 is a sectional view of another embodiment of an LED packagesimilar to the LED package in FIGS. 156 to 159;

FIG. 161 is a top perspective view of another embodiment of an LEDpackage according to the present invention;

FIG. 162 is a bottom perspective view of the LED package shown in FIG.161;

FIG. 163 is a side elevation view of the LED package shown in FIG. 161;

FIG. 164 is a sectional view of the LED package shown in FIG. 160 takenalong section lines 164-164;

FIG. 165 is a graph showing test results for LED packages havereflective layers compared to those without;

FIG. 166 shows a panel of LED packages according to the presentinvention prior to formation of the reflective layer;

FIG. 167 shows the panel of LED package in FIG. 165 after formation ofthe reflective layer, but prior to formation of their encapsulant;

FIG. 168 is an panel of LED packages according to the present inventionwith less than all the top surface of the submount covered by areflective layer;

FIG. 169 is a perspective view image of one embodiment of LED packageaccording to the present invention; and

FIG. 170 is a side view of the LED package shown in FIG. 169.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to different embodiments of LEDpackage structures having a light source that comprises a single orplurality of LED chips. The LED packages can be arranged in differentways and are relatively small, while at the same time are efficient,reliable and cost effective. Some embodiments according to the presentinvention can emit with same or similar efficiency compared to similarLED packages with fully hemispheric encapsulants, but can be smaller andless expensive to manufacture.

The packages according to the present invention can provide theseimprovements by having conversion material and encapsulants that arearranged and shaped to capitalize on the total internal reflection (TIR)of light within the package. That is, the encapsulant can be shaped suchthat light incident on the package encapsulant at angles greater thanthe critical angle for TIR can be reflected back towards a conversionmaterial within the package such that the light is converted or“recycled”. This recycled light is scattered or converted and re-emittedfrom the conversion material omnidirectionally, such that some of theconverted light will be redirected and can reach the surface of theencapsulant at an angle less than the critical angle and emit from thepackage. By arranging the LED packages to provide this photon recyclingof reflected light, such as TIR light, the LED packages can be providedwith different encapsulant shapes and sizes that are closer to that ofthe package light source, and the edge of the light source can be closerto the edge of the encapsulant.

In some embodiments, the LED packages can have planar surfaces thatresult in a certain amount of TIR light within the encapsulant. Usingplanar surfaces can provide increased flexibility in the differentshapes that can be used beyond conventional hemispheric lenses, that aretypically arranged to minimize TIR light, and the use of planar surfacescan allow for more compact LED packages. Some embodiments can compriseone or more LEDs (“LED”) on a submount with contacts and traces forapplying an electrical signal to the one or more LEDs. The LED and thesurface around the LED can be blanketed by a layer of conversionmaterial. The encapsulant can comprise a transparent material that is ina cubic shape over the LED and the submount. The conversion materiallayer can be of the type that converts light from the LED to anothercolor or wavelength of light, and the conversion layer can be of athickness and concentration such that less than all of the LED light isconverted on its first pass through the conversion material.

Some embodiments can comprise LED packages with a blue emitting LED on asubmount, with a yellow conversion material layer over the surface ofthe LED and submount with the conversion material layer converting aportion of the blue light from the LED chip. A cubic encapsulant can beincluded over the LED and submount, with the layer of conversionmaterial between the encapsulant and the LED/submount. The packagesaccording to the present invention can comprise a thinner phosphor layeror lower phosphor concentration than in conventional LED packages at thesame color point, such that more blue light passes through theconversion material layer on the first pass. Since typical conversionlayers also scatter as well as convert blue light, this can lead toimproved package efficiency since the reduced thickness or concentrationof the conversion layer results in less scattering of the first-passblue light emitted by the LED back into the LED, where it may beabsorbed. By achieving a similar color compared to conventional LEDpackages but with a thinner or lower concentration conversion layer,cost savings may also be realized in the manufacture of the LED packagesfabricated according to the present invention. A portion of blue andyellow light from the conversion material reaches the surface of theencapsulant within the critical angle and emits from LED package.Compared to conventional LED packages with hemispheric typeencapsulants, a greater percentage of blue and yellow light willexperience TIR such that light reflects within the encapsulant. Thisresults in the blue and yellow light eventually reaching the conversionmaterial following TIR; i.e. the light is recycled by TIR. Blue TIRlight illuminates that top of the conversion layer, while blue lightfrom the LED illuminates the bottom surface of the conversion layer,such that both sides of the conversion layer are illuminated. The“blanket” effect provided by the conversion material layer limits bothblue and yellow light from re-entering the chip or hitting otherabsorbing regions on the submount. This reduces the amount of light thatmight be absorbed as the light experiences TIR within the package.

The conversion of blue light at the conversion layer results inomnidirectional re-emission of yellow light from the conversion materiallayer. Illumination of both sides of the conversion material layerresults in conversions of TIR blue light into omnidirectional yellowlight. This provides the advantage of allowing for greater opportunitiesfor otherwise TIR light to escape from the package. This recycling canalso scatter light, which can result in LED package emissions patternsthat are wider than conventional devices that provide a predominantlyLambertian emission pattern. This scattering can also result in reducedvariations in color temperature at different viewing angles.

It is understood that in other embodiments, the conversion materiallayer can coat only the LED, leaving the submount uncovered by theconversion material layer. For multiple LEDs embodiments, differentconversion material layers can included on different ones of the LEDs.It also understood that in other embodiments having different conversionmaterial layer embodiments, the different conversion materials can alsocoat some or all of the submount, which can result in differentconversion materials covering all or some of the submount, or differentconversion materials in different areas of the submount. Accordingly, itis understood that in different embodiments, the conversion material canbe on the LEDs, on the submount and/or in the encapsulant. Thesedifferent embodiments can have different combinations of the conversionmaterial locations. Other embodiments can have multiple phosphors on theLEDs, submount and or in the encapsulant. Some of these embodiments cancomprise a three phosphor mixture such as yellow (e.g. YAG), green (e.g.LuAg) and red (e.g. nitride). This is only one example of the manyphosphor mixtures that can be used in different embodiments.

Some package embodiments according to the present invention can compriseLED packages with encapsulants having multiple planar surfaces, with atleast some of the planar surfaces arranged to enhance TIR. Light fromthe package's LED light source can be less likely to reach the planarsurface at angles less than the critical angle and can experience TIR.The planar surfaces can be relatively smooth such that light reachingthe surfaces outside the critical angle experience TIR, without beingredirected or scattered by features such as texturing or shaping. TheLED light source as well as the surrounding substrate and conductivetraces can be covered by a blanket layer of conversion material. TIRlight can be reflected back toward the LED and substrate, and inconventional packages where the substrate comprises an absorbing surfacethe light can be absorbed. By blanketing the LED and the surroundingsurfaces with a converting material, the TIR light can be scattered orconverted and recycled to emit from the LED package before it reachesthe absorbing surfaces, thereby improving package efficiency.

Some embodiments of LED packages according to the present invention cancomprise a plurality of LEDs or LED chips on a submount, with contacts,attach pads and/or traces for applying an electrical signal to the oneor more LEDs. The plurality of LEDs can emit the same color of light orcan emit different colors of light such that the LED package emits thedesired color combination of the light from the LED chips. The LEDpackages can be arranged with LED chips in different patterns, and insome embodiments the LED chips can be of the same type that emits thesame color of each type could be used, and in other embodimentsadditional LEDs can be used that produce additional colors of light. Insome embodiments, all or some of the LED chips can be covered by theconversion material, with others of the LED chips uncovered. By usingone or more LEDs emitting one or more additional colors and/or havingsome covered by a wavelength conversion material, the color renderingindex (CRI) of the lighting unit can be increased. As mentioned aboveand described in more detail below, the conversion material layer cancomprise one or more conversion materials, such as phosphors, to providethe desired LED package emission, such as the white light with thedesired temperature and CRI. A further detailed example of using LEDsemitting light of different wavelengths to produce substantially whitelight can be found in issued U.S. Pat. No. 7,213,940, which isincorporated herein by reference.

Some LED packages according to the present invention can comprise afirst group of LED chips coated by the conversion material layercomprising at least one conversion material. The packages also includeone or more of a second type of LED chip emitting at a differentwavelength of light, with the second LED chips not covered by theconversion material. Each of the first group of LED chips, ifilluminated, can emit a blue light having a dominant wavelength in therange of from 430 nm to 480 nm. The conversion material layer can beexcited by the blue light, and can absorb at least some of the bluelight and can reemit light having a dominant wavelength in the range offrom about 555 nm to about 585 nm. This light can be referred to as blueshifted yellow (BSY) light. The second LED chip type can be uncovered bythe conversion material layer and if energized with current, can emitred or orange light having a dominant wavelength in the range of from600 nm to 650 nm.

With both the first and second LED chips emitting light, the LEDpackages can emit a combination of (1) blue light exiting the packagefrom the first group of LED chips, (2) BSY light exiting the packagecomprising light from the first LED chips absorbed by the conversionmaterial layer and then reemitted and (3) light exiting the lightingdevice from the second group of LED chips in the red or orangewavelength regime. In an absence of any additional light, this canproduce an LED package emission mixture of light having x, y coordinateson a 1931 CIE Chromaticity Diagram different from the primary emitterwavelengths and within the polygon created by the x, y color coordinatesof the emissions of the first, second LED chips and the individualconversion material constituents. The combined light emissioncoordinates may define a point that is within ten MacAdam ellipses of atleast one point on the blackbody locus on a 1931 CIE ChromaticityDiagram. In some embodiments, this combination of light also produces asub-mixture of light having x, y color coordinates which define a pointwhich is within an area on a 1931 CIE Chromaticity Diagram enclosed byfirst, second, third, fourth and fifth connected line segments definedby first, second, third, fourth and fifth points. The first point canhave x, y coordinates of 0.32, 0.40, the second point can have x, ycoordinates of 0.36, 0.48, the third point can have x, y coordinates of0.43, 0.45, the fourth point can have x, y coordinates of 0.42, 0.42,and the fifth point can have x, y coordinates of 0.36, 0.38.

The different packages according to the present invention can have oneor more LEDs with many different shapes, sizes and features. In somepackage embodiments the LED chips can have surfaces that are textured,while other embodiments can have LEDs and an encapsulant that can beshaped so that they have surfaces that are oblique to one another. Instill other embodiments, the LED chips can be made of materials andshaped such that LED chip surfaces are generally parallel to thesurfaces of the encapsulant.

As described in more detail below, the encapsulant can comprise manydifferent shapes with planar surfaces, and in some embodiments, theencapsulant can be cube shaped and can be included over the LEDs chipsand the submount. The conversion material layer can be included betweenthe encapsulant and the LEDs array and submount. In other embodiments,the conversion material can be included in the encapsulant, but isformed in a layer or region that occupies less than all of theencapsulants. In some embodiments, the conversion material layer can beformed in the encapsulant in the lower portion of the encapsulant, whilein other embodiments it can be formed as a layer at or near the bottomof the encapsulant.

The LED packages according to the present invention can comprise athinner phosphor layer or lower phosphor concentration than inconventional LED packages at the same color point, such that more bluelight passes through the conversion material layer on the first pass.Since typical conversion layers also scatter as well as convert bluelight, this can lead to improved package efficiency since the reducedthickness or concentration of the conversion layer results in lessscattering of the first-pass blue light emitted by the LED back into theLED, where it may be absorbed. By achieving a similar color compared toconventional LED packages but with a thinner or lower concentrationconversion layer, cost savings may also be realized in the manufactureof the LED packages fabricated according to the present invention. Aportion of blue and yellow light from the conversion material reachesthe surface of the encapsulant within the critical angle and emits fromLED package. Compared to conventional LED packages with hemispheric typeencapsulants, a greater percentage of blue and yellow light willexperience TIR such that light reflects within the encapsulant. Thisresults in the blue and yellow light eventually reaching the conversionmaterial following TIR; i.e. the light is recycled by TIR. Blue TIRlight illuminates the top of the conversion layer, while blue light fromthe LED illuminates the bottom surface of the conversion layer, suchthat both sides of the conversion layer are illuminated. The “blanket”effect provided by the conversion material layer limits both blue andyellow light from re-entering the chip or hitting other absorbingregions on the submount. This reduces the amount of light that might beabsorbed as the light experiences TIR within the package.

The conversion of blue light at the conversion layer results inomnidirectional re-emission of yellow light from the conversion materiallayer. Illumination of both sides of the conversion material layerresults in conversions of TIR blue light into omnidirectional yellowlight. This provides the advantage of allowing for greater opportunitiesfor otherwise TIR light to escape from the package. This recycling canalso scatter light, which can result in LED package emissions patternsthat are wider than conventional devices that provide a predominantlyLambertian emission pattern. This scattering can also result in reducedvariations in color temperature at different viewing angles.

It is understood that in other embodiments, the conversion materiallayer can coat only one or more of the LEDs, leaving the submountuncovered by the conversion material layer. For multiple LEDembodiments, different conversion material layers can be included ondifferent ones of the LEDs. It also understood that in other embodimentshaving different conversion material layer embodiments, the differentconversion materials can also coat some or all of the submount, whichcan result in different conversion materials covering all or some of thesubmount, or different conversion materials in different areas of thesubmount. Accordingly, it is understood that in different embodiments,the conversion material can be on the LEDs, on the submount and/or inthe encapsulant. These different embodiments can have differentcombinations of the conversion material locations. Other embodiments canhave multiple phosphors on the LEDs, submount and/or in the encapsulant.Some of these embodiments can comprise a three phosphor mixture such asyellow (e.g. YAG), green (e.g. LuAg) and red (e.g. nitride). This isonly one example of the many phosphor mixtures that can be used indifferent embodiments. In still other embodiments, the emitters andsubmount can be provided without a conversion material layer, or aconversion material can be included only on the submount. In theseembodiments, the packages can comprise LEDs emitting different colors oflight that combine to produce the desired LED package emission. This caninclude, for example, red, green and blue emitting LEDs whose emissioncan be combined to produce white light. Like other embodiments discussedherein, these different LEDs can be individually addressable.

Other mechanisms which re-direct light within the encapsulant, such asscattering or refraction, may be used in combination with or in place ofTIR. For example, in one embodiment, a scattering material may be addedto the encapsulant to further enhance color uniformity in the lightemitted by the package, or to produce a broader beam intensity profilewhile maintaining high package efficiency. The LED packages according tothe present invention can be used with many different luminaires, withthe LED packages resulting in improved color mixing. This can resultluminaires producing the desired emission without the need for mixingchambers, or with the use of reduced height mixing chambers.

The different embodiments can also comprise LED packages with relativelysmall footprints, with some having a footprint smaller than 3 mm square,while other embodiments can have a footprint smaller than 2 mm square.These embodiments can also provide devices having a footprint that iscloser in size to the area covered by the LED. The embodiments can alsoexhibit height and footprint dimensions that are relatively close to oneanother as further described below.

For those embodiments with multiple LED light sources, individual onesof the LEDs can be individually addressable or controlled, or differentstrings or subsets of the multiple LEDs can be individually addressableor controlled. A string can be one LED or multiple LEDs coupled togetherin different parallel and/or serial connections to achieve the desiredoperating voltages or to achieve the desired package emission colortemperature. This can be applicable to many different packagearrangements such as those having LEDs emitting different colors or LEDswith phosphor coating that are from different bins.

Different LED packages according to the present invention can havedifferent shaped encapsulants to produce the desired emission profileand emission efficiency. Some embodiments can comprise encapsulantswhere not all of the surfaces are planar, with some comprising a hybridcombination of planar and curved surfaces. Some of these embodiments cancomprise one or more LEDs mounted on a submount, with the encapsulanthaving an upper curved surface and planar side surfaces. The uppersurface can have a radius of curvature that is greater than half thelength or width of the submount, with the planar surfaces comprisingtruncated sections of the encapsulant so that the encapsulant does notoverhang the edge of the submount. This can result in planar surfaceswith a curved edge as described below.

Encapsulants with a′ combination of planar and curved surfaces canprovide different emission patterns, with some providing a more narrowemission profile compared to LED packages having encapsulants with allplanar surfaces. In some embodiments the emission profile can be lessthan 120° FWHM. These LED packages can also maintain their relativelysmall size/footprint, emission efficiency and limited variations incolor temperature at a range of viewing angles. The differentembodiments according to the present invention can have many differenttypes of encapsulants with many different combinations of planar andcurved surfaces.

The different embodiments of LED packages according to the presentinvention can also comprise features to improve light extraction andthereby increase overall emission efficiency. In some of theseembodiments, a reflective layer can be included to reflect light thatmight otherwise encounter a light absorbing surface. The reflectivelayer can be on the surface of a package submount that is also has thepackages light emitters. The reflective layer can reflect light awayfrom the light absorbing surfaces of the submount and in a directionsuch that it can contribute to the overall emission efficiency of thepackage. The reflective layer can be arranged to cover differentpercentages of the submount, with some embodiments having a reflectivelayer that is on the surface or the submount from the edge of theemitters to the edge of the submount. The resulting reflective layercovers substantially all of the surface of the submount not covered bythe light emitters.

The present invention is described herein with reference to certainembodiments, but it is understood that the invention can be embodied inmany different forms and should not be construed as limited to theembodiments set forth herein. In particular, the present invention isdescribed below in regards to certain LED packages having LEDs indifferent configurations, but it is understood that the presentinvention can be used for many other LED packages with other LEDconfigurations. The LED packages can also have many different shapesbeyond those described below, such as rectangular, and the solder padsand attach pads can be arranged in many different ways. In otherembodiments, the emission intensity of the different types of LED chipscan be controlled to vary the overall LED package emission.

The present invention can be described herein with reference toconversion materials, wavelength conversion materials, remote phosphors,phosphors, phosphor layers and related terms. The use of these termsshould not be construed as limiting. It is understood that the use ofthe term remote phosphors, phosphor or phosphor layers is meant toencompass and be equally applicable to all wavelength conversionmaterials.

The embodiments below are described with reference to an LED or LEDs,but it is understood that this is meant to encompass LED chips, andthese terms can be used interchangeably. These components can havedifferent shapes and sizes beyond those shown, and one or differentnumbers of LEDs can be included. It is also understood that theembodiments described below utilize co-planar light sources, but it isunderstood that non co-planar light sources can also be used. It is alsounderstood that an LED light source may be comprised of multiple LEDsthat may have different emission wavelengths. As mentioned above, insome embodiments at least some of the LEDs can comprise blue emittingLEDs covered with a yellow phosphor along with red emitting LEDs,resulting in a white light emission from the LED package. In multipleLED packages, the LEDs can be serially interconnected or can beinterconnected in different serial and parallel combinations.

It is also understood that when an feature or element such as a layer,region, encapsulant or submount may be referred to as being “on” anotherelement, it can be directly on the other element or intervening elementsmay also be present. Furthermore, relative terms such as “inner”,“outer”, “upper”, “above”, “lower”, “beneath”, and “below”, and similarterms, may be used herein to describe a relationship of one layer oranother region. It is understood that these terms are intended toencompass different orientations of the device in addition to theorientation depicted in the figures.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers and/or sections, theseelements, components, regions, layers and/or sections should not belimited by these terms. These terms are only used to distinguish oneelement, component, region, layer or section from another region, layeror section. Thus, a first element, component, region, layer or sectiondiscussed below could be termed a second element, component, region,layer or section without departing from the teachings of the presentinvention.

Embodiments of the invention are described herein with reference tocross-sectional view illustrations that are schematic illustrations ofembodiments of the invention. As such, the actual thickness of thelayers can be different, and variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances are expected. Embodiments of the invention should notbe construed as limited to the particular shapes of the regionsillustrated herein but are to include deviations in shapes that result,for example, from manufacturing. A region illustrated or described assquare or rectangular will typically have rounded or curved features dueto normal manufacturing tolerances. Thus, the regions illustrated in thefigures are schematic in nature and their shapes are not intended toillustrate the precise shape of a region of a device and are notintended to limit the scope of the invention.

Reflectivity includes reflective to emitter as well as conversionmaterial. Can be made of many different materials applied in manydifferent ways

FIGS. 4 through 13 show one embodiment of an LED package 50 according tothe present invention comprising an LED 52, mounted on a submount 54.The LED package 50, also comprises first and second bottomcontact/solder pads 60 a and 60 b on the bottom of the submount 54,first and second conductive vias 62 a, 62 b passing through the submount54, and first and second die attach pads 64 a, 64 b on the top surfaceof the submount 54. The LED package further comprises a conversionmaterial layer 56 covering the LED 52, the exposed surfaces of the dieattach pads 64 a, 64 b, and exposed portions of the top surface of thesubmount 54. An encapsulant 58 is included over the LED 52, the attachpads 64 a, 64 b, and the submount 54. The above features of the LEDpackage are described in detail below.

The LED 52 is shown as a single LED, but it is understood that in otherembodiments (such as those described below) the light source cancomprise more than one LED. Many different LEDs can be used such asthose commercially available from Cree Inc., under its DA, EZ, GaN, MB,RT, TR, UT and XT families of LED chips, among others. The LED package50 is particularly arranged for use with the DA family of chips such asthe DA850 chip that can be flip chip mounted and allows for wire-freebonding. These types of chips are generally described in U.S. patentapplication Ser. No. 12/463,709 to Donofrio et al., entitled“Semiconductor Light Emitting Diodes Having Reflective Structures andMethods of Fabricating Same,” which is incorporated herein by reference.The LED 52 can emit many different colors of light, with a preferred LED52 emitting light in the blue wavelength spectrum. It is understood thatin some embodiments the LED can be provided following removal of itsgrowth substrate. In other embodiment, the LED's growth substrate canremain on the LED 52, with some of these embodiments having a shaped ortextured growth substrate.

In other embodiments, more than one LED can be used as the light source,while in other embodiments solid state lasers can used either alone orin combination with one or more LEDs. In some embodiments, the LEDs cancomprise a transparent growth substrate such as silicon carbide,sapphire, GaN, GaP, etc. The LED chips can also comprise a threedimensional structure and in some embodiments, the LEDs can havestructure comprising entirely or partially oblique facets on one or moresurfaces of the chip.

The LED package 50 further comprises a submount 54, with the LED 52mounted to the submount 54. The submount 54 can be formed of manydifferent materials with a preferred material being electricallyinsulating, such as a dielectric material. The submount 54 can comprisea ceramic such as alumina, aluminum nitride, silicon carbide, or apolymeric material such as polymide and polyester. In the preferredembodiment, the submount 54 can comprise a dielectric material having arelatively high thermal conductivity, such as aluminum nitride andalumina. In other embodiments the submount 54 can comprise a printedcircuit board (PCB), sapphire or silicon or any other suitable material,such as T-Clad thermal clad insulated substrate material, available fromThe Bergquist Company of Chanhassen, Minn. For PCB embodiments differentPCB types can be used such as standard FR-4 PCB, metal core PCB, or anyother type of printed circuit board.

The top surface of the submount 54 is shown having a planar surface withpatterned conductive features that can comprise first and second dieattach pads 64 a, 64 b. A space is provided between the attach pads 64a, 64 b, with the LED chip 52 mounted to the pads 64 a, 64 b such thatrespective portions of the LED 52 are mounted to a respective one of thepads 64 a and 64 b and the LED 52 spans the space between the attachpads 64 a, 64 b. Many different mounting methods can be used, such asmethods utilizing conventional solder materials. Other types of LEDchips can be electrically connected to the attach pads 64 a, 64 b orother conductive traces using known surface mount or wire bondingmethods depending on the geometry of the LED 52.

The pads 64 a, 64 b can comprise many different materials, such asmetals or other conductive materials, and in one embodiment they cancomprise copper deposited using known techniques such as plating. Inother embodiments, pads 64 a, 64 b can be sputtered using a mask to formthe desired pattern, and in other embodiments they can be formed usingknown photolithography processes. The pads 64 a, 64 b can extend beyondthe edge of the LED 52 to cover most of the top surface of the submount54. This helps in thermal management for the LED package 50 by spreadingheat from the LED 52 into the pads 64 a, 64 b so that heat spreadsbeyond the edge of the LED 52 into more area of the submount 54. Thisallows the heat to be less localized and allows it to more efficientlydissipate through the surmount 54 into the ambient.

The conversion material layer 56 is included over the LED 52, exposedportions of the pads 64 a and 64 b, and exposed portions of thesubmount's top surface. Many different conversion materials can be usedto generate the desired LED package light emission, with the presentinvention being particularly adapted to LED packages emitting whitelight. In some white emitting embodiments, the LED 52 can emit light inthe blue wavelength spectrum. The conversion material can be of the typethat absorbs blue light and re-emits yellow light such that the packageemits a white light combination of blue and yellow light. In someembodiments, the conversion material can comprise a commerciallyavailable YAG:Ce phosphor, although a full range of broad yellowspectral emission is possible using conversion particles made ofphosphors based on the (Gd,Y)₃(Al,Ga)₅O₁₂:Ce system, such as theY₃Al₅O₁₂:Ce (YAG). Other yellow phosphors that can be used include butare not limited to:

Tb_(3-x)RE_(x)O₁₂:Ce(TAG); RE=Y, Gd, La, Lu; orSr_(2-x-y)Ba_(x)Ca_(y)SiO₄:Eu.

In other embodiments, the conversion material layer can be arranged withmore than one phosphor material either mixed or in separate layers. Insome embodiments, each of the two phosphors can absorb the LED light andcan re-emit different colors of light. In these embodiments, the colorsfrom the two phosphor layers can be combined for higher CRI white ofdifferent white hue (warm white). This can include light from yellowphosphors above that can be combined with light from red phosphors.Different red phosphors can be used including:

Sr_(x)Ca_(1-x)S:Eu, Y; Y=halide;

CaSiAlN₃:Eu; or Sr_(2-y)Ca_(y)SiO₄:Eu

Other phosphors can be used to create color emission by convertingsubstantially all light to a particular color. For example, thefollowing phosphors can be used to generate green light:

SrGa₂S₄:Eu; Sr_(2-y)Ba_(y)SiO₄:Eu; or SrSi₂O₂N₂:Eu.

The following lists some additional suitable phosphors used asconversion particles, although others can be used. Each exhibitsexcitation in the blue and/or UV emission spectrum, provides a desirablepeak emission, has efficient light conversion, and has acceptable Stokesshift:

Yellow/Green (Sr, Ca, Ba) (Al, Ga)₂S₄:Eu²⁺ Ba₂(Mg, Zn) Si₂O₇:Eu²⁺Gd_(0.46)Sr_(0.31)Al_(3.23)O_(x)F_(1.38): Eu²⁺ _(0.06)(Ba_(1-x-y)Sr_(x)Ca_(y))SiO₄:Eu Ba₂SiO₄:Eu²⁺ LU₃Al5O₁₂:Ce³⁺ RedLu₂O₃:Eu³⁺ (Sr_(2-x)La_(x))(Ce_(1-x)Eu_(x))O₄ Sr₂Ce_(1-x)Eu_(x)O₄Sr_(2-x)Eu_(x)CeO₄ SrTiO₃:Pr³⁺,Ga³⁺ CaAlSiN₃:Eu²⁺Ca_(1-x)Sr_(x)SiAlN₃:Eu²⁺ Sr₂Si₅N₈:Eu²⁺

In still other certain embodiments, the conversion material layer cancomprise at least three phosphors, with some embodiments comprising acombination of yellow, red and green phosphors. Other combinations arepossible, and other embodiments can comprise more than three phosphors.Many different yellow, red and green phosphors can be used, such asthose described above.

The conversion material can comprise different sized phosphor particlesincluding but not limited to particles in the range of 10 nanometers(nm) to 30 micrometers (μm), or larger. Smaller particle sizes typicallyscatter and mix colors better than larger sized particles to provide amore uniform light. Larger particles are typically more efficient atconverting light compared to smaller particles, but emit a less uniformlight. In some embodiments, the phosphor can be fixed in the conversionmaterial layer in a binder, and the phosphor can also have differentconcentrations or loading of phosphor materials in the binder. A typicalconcentration of phosphor in a binder is typically a range of 30-70% byweight. In one embodiment, the phosphor concentration is approximately65% by weight, and is preferably uniformly dispersed throughout theremote phosphor. The conversion material layer 56 can also havedifferent regions with different concentrations of phosphor particles.

Alternate wavelength conversion materials may also be used todown-convert light to generate white emissions. Such materials may be,but are not limited to organic fluorescent materials or dyes orinorganic quantum dot materials such as CdSe/ZnS, InP/InAs, CdS/CdSe,CdTe/CdSe or others.

The conversion material layer 56 can have many different thicknessesdepending at least partially on the concentration of conversionmaterial, the size of the conversion material particles, and the desiredamount of light to be converted by the conversion material. Conversionmaterial layer according to the present invention can be in a binderwith phosphor concentration levels (phosphor loading) above 30%. Otherembodiments can have concentration levels above 50%, while in stillothers the concentration level can be above 60%. In some embodiments thephosphor binder combination can have thicknesses in the range of 10-100microns, while in other embodiments it can have thicknesses in the rangeof 40-50 microns. Thickness may also vary across the layer, withdifferent regions having different thicknesses. As described in moredetail below, the different packages according to the present inventioncan comprise conversion layers with less phosphor material (e.g. thinneror lower concentration) compared to similar packages with hemisphericencapsulants, while still maintaining the desired emission color point.This reduction in thickness depends on many different factors, such asthe phosphor type, size of phosphor particles, and concentration ofphosphor particles in the layer. In some embodiments, the reduction canbe 10% or more compared to a similar LED package with hemispheric lens.In still other embodiments it can be 20% or more, while in otherembodiments it can be 30% or more.

The conversion material layer 56 can also comprise a binder, anddifferent materials can be used for the binder, with materialspreferably being robust after curing and substantially transparent inthe visible wavelength spectrum. Suitable materials include silicones,epoxies, glass, inorganic glass, dielectrics, BCB, polymides, polymersand hybrids thereof, with the preferred material being silicone becauseof its high transparency and reliability in high power LEDs. Suitablephenyl- and methyl-based silicones are commercially available from Dow®Chemical. The binder can be cured using many different curing methodsdepending on different factors such as the type of binder used.Different curing methods include but are not limited to heat,ultraviolet (UV), infrared (IR) or air curing. It is understood,however, that the phosphor particles can be applied without a binder.

The conversion material layer can be applied using different processesincluding but not limited to spraying, dispensing, spin coating,sputtering, printing, powder coating, electrophoretic deposition (EPD),and electrostatic deposition, among others. These processes can alsoinclude a solvent in the phosphor-binder mixture that can liquefy andlower the viscosity of the mixture. Many different solvents can be usedincluding but not limited to toluene, benzene, zylene, or OS-20commercially available from Dow Corning®, and different concentration ofthe solvent can be used. When the solvent-phosphor-binder mixture issprayed, poured or dispersed heat from the remote phosphor evaporatesthe solvent and can also cure the binder in the mixture leaving a fixedphosphor layer. Various deposition methods and systems are described inU.S. Patent Application Publication No. 2010/0155763, to Donofrio etal., entitled “Systems and Methods for Application of Optical Materialsto Optical Elements,” and also assigned to Cree, Inc.

Encapsulant 58 is included on the conversion material layer 56, and overthe LED 52 and submount 54, with the encapsulant 58 providingenvironmental and mechanical protection, as well as allowing for therecycling of light as described above and described in more detailbelow. Unlike most conventional encapsulants formed over an LED, theencapsulant 58 has planar surfaces, and in the embodiment shown theencapsulant 58 has a generally cubic shape. The encapsulant includesboth vertical and horizontal planar surfaces in the shape of a cube, butit is understood that encapsulant can take many different shapes such asany shape having a flat top and vertical sidewalls with planar surfaces.These can include but are not limited to different prismatic or polygonshapes such as triangles, pentagons, hexagons, octagons, etc. Theseshapes can include a horizontal planar surface, with vertical surfacesnumbering in the range of 3 to 12 or more. In still other embodiments,the encapsulant can be cylindrical with different cross sections such ascircular or oval.

It is understood that encapsulant 58 and the LED 52 can be aligned inmany different ways, with the LED 52 as shown approximately aligned withthe center or longitudinal axis of the encapsulant 58. In otherembodiments, the LED 52 can be closer to one of the edges of theencapsulant 58.

Many different materials can be used for the encapsulant 58 such assilicones, plastics, epoxies or glass, with a suitable material beingcompatible with molding processes. Silicone is suitable for molding andprovides suitable optical transmission properties. It can also withstandsubsequent reflow processes and does not significantly degrade overtime. The encapsulant can also be formed using many different methods,and in some embodiments a molding process (described in more detailbelow) can be used that simultaneously forms encapsulants 58 over amultitude of LEDs 52 on a submount panel.

In different embodiments, the encapsulant can have many differentthicknesses, with some providing just enough encapsulant material tocover the LED and phosphor layer. In these embodiments, the layer can beas thin as 10 μm or more. In still other embodiments, the encapsulantcan be as high as three times the submounts edge dimension. These areonly some examples of encapsulant height, with other embodiments beingthinner or higher.

In some embodiments, the top surface of the encapsulant can have aslightly smaller area than the bottom of the encapsulant and/or thefootprint of the LED package. In still other embodiments, the upperportions of the encapsulant can have a larger area than lower portions,or a larger area than the LED package footprint.

The LED chip 50 also comprises first and second solder pads 60 a, 60 bformed on the bottom surface of the submount 54, which can be used formounting the LED package 52 in place using known mounting methods. It isunderstood that in other embodiments (as described below), LED packagesaccording to the present invention can have more than two solder pads.The solder pads 60 a, 60 b can be made of the same materials and can beformed of the same way as die attach pads 64 a, 64 b. First and secondconductive vias 62 a, 62 b can be included that pass through thesubmount 54 with the vias being formed of an electrically conductivematerial such as those used for the die attach pads and solder pads, andare arranged to provide an electrically conductive path between thesolder pads 60 a, 60 b and the die attach pads 64 a, 64 b. In theembodiment shown, first via 62 a forms an electrically conductive pathbetween the first solder pad 60 a and the first die attach pad 64 a,while second via 62 b provides a conductive path between the secondsolder pad 60 b and the second die attach pad 64 b. This allows anelectrical signal applied to the solder pads 60 a, 60 b to be conductedthrough the submount 54 along the vias 62 a, 62 b, to the die attachpads 64 a, 64 b. The signal is then conducted to the LED 52, through thedie attach pads. It is understood that in other embodiments theelectrical signal can be transmitted to the LED in other ways such asthrough conductive traces or wire bond pads arranged in differentlocations in the LED package, and running between the mounting surfaceor the submount, and the LED.

As mentioned above, the LED packages according to the present inventionare relatively small, and as LED packages become smaller less space isavailable for including indicators showing polarity of an LED package.These indicators can be important when manufacturing the end productutilizing the LED packages. Conventional polarity indicators cancomprise marks on the top surface of the LED package or where one solderpad can be larger than the other. With smaller LED packages there can beless room for marking on the top surface, and it can also be undesirableto make on solder pad smaller than the other because of resultingincreases in the danger of soldering defects.

The LED packages according to the present invention provide improvedstructures and methods of providing polarity indication by forming oneor more indication notches 66 in one of the solder pads. As best shownin FIGS. 5 and 9, V-shaped polarity indication notch 66 can be formedalong the inner edge of the solder pad 64 a. This notch 66 can bedetected with up-looking cameras on automated pick-and-place equipmentduring manufacturing. In the embodiment shown, the notch 66 is near thecenter of the pad's inner edge placing it near the center of thesubmount 54. Referring now to FIG. 16, a conventional LED packagecarrier tape 80 is shown that comprises holes 82 beneath each of the LEDpackages it carries. The notch 66 in FIGS. 8 and 9 is in the area of thesubmount 54 near the center that can be visible through hole 82 in thecarrier tape 80. This allows for the notch (and the corresponding LEDpackage polarity) to be visible and verified carrier tape hole 82without removing the LED package from the carrier tape 80.

The notch 66 can have many different shapes beyond V-shaped, such asU-shaped, I-shaped, W-shaped, square shaped, rectangular shaped, starshaped, plus shaped, minus shaped, etc. The notch can also be includedin many different locations on the solder pads 60 a, 60 b as furtherdescribed below, and can similarly be detected by the camera ofconventional pick and place equipment. It is noted that other types ofpolarity indicators can be used, such as holes of different shapes orother cutouts in the solder pads, and in other embodiments the LEDpackages can have indicators in other locations, such as on the submount54.

Referring again to FIGS. 4 through 9, some embodiments according to thepresent invention can also comprise polarity indicators on the topsurfaces of the LED package 50. In the embodiment shown, the secondattach pad 64 b can have a plus (+) indicator 68 to show polarity whenviewing the LED package 50 from the top. These indicators can take manydifferent shapes and sizes such as those described above, and in someembodiments can comprise notches or holes as described above. As alsomentioned above, for LED packages of the size shown in the attachedfigures and described herein, there may be limited space for toppolarity indicators, and manufacturing devices may need to rely on thebottom polarity indicators.

Referring to FIGS. 10 and 13, the LED package 50 is shown without thesubmount 54 being visible through the encapsulant 58. This is done forease of illustration, but it is understood that some embodimentsaccording to the present invention can have an encapsulant that is nottransparent for different reasons. In some embodiments the encapsulantcan have phosphors and/or scattering particles dispersed throughout orin particular locations in the encapsulant. This can make theencapsulant either partially or fully opaque. FIG. 14 shows onerecommended solder pad for some LED packages according to the presentinvention, and FIG. 15 shows the recommended trace layout.

As mentioned above, conventional knowledge in art was that TIR of LEDlight resulting from the planar surfaces of the encapsulant would resultin significant reduction in LED package emission efficiency. This isparticularly true for LED packages with vertical planar surfaces. It wasthought that the TIR light would encounter light absorbing features ofthe LED package and would result in significant percentage of lightbeing absorbed. This conventional knowledge focused on LED packagesproviding encapsulants that minimize TIR, such as hemisphericencapsulants. The focus was also on providing package light sources nearthe center of the base of the encapsulant to simulate a point sourcenear the center. However, by providing a blanket conversion materiallayer over the top surfaces under the encapsulant 58, including on theLED 52, areas of the die attach pads 64 a, 64 b around the LED 52, andthe top surface of the submount 54 exposed around the LED 52 and theattach pads 64 a, 64 b, this expected efficiency loss can be minimizedor eliminated.

Referring now to FIG. 17, an exemplary LED package 90 according to theinvention is shown with sample blue and yellow light traces 92, 94. TheLED package 90 comprises many of the same or similar features to thosein LED package 50, and for those features the same reference numberswill be used herein. The LED package 90 comprises an LED 52, submount54, conversion material layer 56, and an encapsulant 58. The LED package90 can be arranged to emit different colors of light, and in theembodiment shown the LED chip 52 emits blue light, and the conversionmaterial layer 56 comprises a conversion material that converts bluelight to yellow light. Referring to the blue light trace 92, a portionof the blue light passes through the conversion material layer 56 andexperiences TIR when it reaches the surface of the encapsulant 58. Otherportions of the blue light trace 92 pass out of the encapsulant tocontribute to emission from the LED package.

The blue TIR light reflects within the encapsulant and is eventuallydirected back toward the submount 54. Instead of reaching a lightabsorbing portion of the LED package, the TIR reaches the conversionmaterial layer 56. This blue light has already passed through theconversion layer 56, and following TIR the blue LED light encounters theconversion material layer a second time. This can be referred to as“recycling” of the blue light that results in illumination of the topsurface of the conversion material layer 56 such that both sides of thelayer are illuminated by blue light during operation. The conversionmaterial layer 56 provides a “blanket” effect that helps limit both blueand yellow light from re-entering the chip or hitting absorbing regions.When the blue light 92 hits the conversion material layer 56 a secondtime, all or a portion of the light will be scattered or absorbed by theconversion material in the layer and re-emitted as yellow light. There-emission will be omnidirectional or isotropic such that a portion ofthe TIR light will be redirected so that it emits from the LED package.This omnidirectional reemission amounts to scattering of otherwise TIRlight to allow for the light to reach the encapsulant surface within thecritical angle and emit from the encapsulant.

When the blue light passes through the conversion material layer thefirst time, a portion of the blue light is converted to yellow light asshown in light trace 94. A portion of yellow will emit from the packageon its first pass, while the remainder will experience TIR. This lightcan also experience scattering when it encounters the phosphor materiala second time, increasing the likelihood that some of the light willemit from the encapsulant and contribute to overall emission.

The result is that the TIR and recycling allows for emissionefficiencies of the LED packages according to the present invention tobe similar to conventional hemispheric lensed LEDs. Embodiments of thepresent invention have reduced concentrations of conversion material inthe conversion material layer to achieve the same color point due to therecycling effect. This can allow for more blue light to pass through thephosphor on the first pass. Since typical conversion layers can scatteras well as convert blue light, a reduced thickness or concentration ofconversion material on the chip can mean that less of this first-passblue light is scattered back into the LED where it may be absorbed,thereby improving package efficiency. This first-pass blue light canthen be converted and scattered when it reaches the conversion materiallayer 56 a second time. This scattering allows for more light to escapefrom the LED package, while maintaining the proper emission balancebetween blue and yellow light to achieve the desired color point. Thedifferent embodiments can comprise 20-30% less conversion materialcompared to conventional LED packages. Other embodiments can comprise10-40% less conversion material compared to conventional LEDs. Thisreduction in conversion material, as well as reduced package size, canresult in less costly LED packages with the same or similar emissionefficiencies. This arrangement allows for smaller devices, which canalso reduce costs.

In some embodiments, the scattering during recycling of the light canalso provide additional advantages of a broader emission profile. Inmost conventional LED packages the emission profile is generallyLambertian with most having an emission profile of approximately 120°FWHM or less. The scattering of light provided in the embodiments of thepresent invention provide more light emitting from the encapsulant atgreater angles than would be experienced in a conventional lambert ionemission profile. In some embodiments, the emission profile can exceed120 degrees FWHM, while in other embodiments it can exceed 130 degreesFWHM. In still other embodiments the emission profile can be in therange of 130 to 170° FWHM, or 130 to 160° FWHM, or 130 to 150° FWHM inother embodiments. FIG. 18 is a graph 100 showing an emission profile102 for one embodiment of an LED package according to the presentinvention having and emission profile of approximately 150° FWHM. Inother embodiments the emission profile can be greater than 135° FWHM,with less than 10% color variation of viewing angles of −90° to +90°.

As mentioned above, scattering materials may be added to the encapsulantto further increase the width of the emission profile and improve coloruniformity with minimal impact on package efficiency. This wideremission profile allows for the LED packages according to the presentinvention to be particularly applicable to lighting applications needingwider angles of emission, such as area lighting. For LED lighting thatrelies on mixing chambers to mix light from the LED packages, thebroader emission pattern can result in lighting fixtures with reducedmixing chamber depths.

The LED packages according to the present invention can also emit lightwith more uniform color emission at different viewing angles. In someembodiments, the packages emit light with variations in colortemperature of less than −400 to +400 kelvin and viewing angles ofapproximately −100 to +100 degrees. In still other embodiments, thevariations in color temperature can be less than −300 to +300 kelvin andviewing angles of approximately −100 to +100 degrees. FIG. 19 is a graph110 showing variations in color temperature 112 over viewing angle forone embodiment of an LED package according to the present invention. Thevariations over viewing angles are from −100 to +100 degrees and aregenerally in the range of −100 to +200 Kelvin.

The blanketing of the conversion material layer also allows theconversion material layer to act as a remote layer with good thermalspreading. That is, heat generated during the conversion process, orheat from the LED 52 that passes into the conversion material layer 56can be spread across the conversion material layer 56. The heat can thenconduct into the submount 54 and the encapsulant 58 to dissipate intothe surrounding ambient. This allows for more efficient dissipation ofheat compared to conventional packages having LEDs with conversionmaterial only on the LED.

Some embodiments according to the present invention provide LED packageshaving smaller footprints compared to conventional LED packages withhemispheric encapsulants, while still emitting with the same or similarefficiency. In some embodiments, the LED package footprint can be lessthan 3 mm by 3 mm or larger, while in other embodiments it can be 2 mmby 2 mm or larger. In still other embodiments it can be 1 mm by 1 mm orlarger with some embodiments according to the present invention beapproximately 1.6 mm by 1.6 mm. In some embodiments, the footprint canbe less than 12 mm square. In still other embodiments the footprint canhave an area of less than approximately 9 mm square, less than 6 mmsquare, or less than 4 mm square. In some embodiments the package canhave a footprint area in the range of 1 to mm. In some embodiments theLED package can have an approximately 1.6 mm by 1.6 mm submount, with afootprint area of approximately 2.56 mm square.

The LED packages according to the present invention can be scalable tomany different larger or smaller sizes. The encapsulants in LED packagesaccording to the present invention can extend up to the edge of thesubmount, while LED packages with hemispheric encapsulants can havesubmounts that extend beyond the edge of the encapsulant, therebyincreasing the overall size of the package footprint.

The LED package according to the present invention can also provide forefficient light emission for devices with a smaller ratio of LED chiparea to LED package footprint. This allows for the edge of the LED to becloser to the edge of the encapsulant to provide greater LED emissionarea per LED package footprint. In some embodiments, the edge of the LEDchip (or LED chip array) can be approximately at or near the edge of theencapsulant such that the LED package has substantially the samefootprint as the LED chips (or LED chip array). In some embodiments, theratio of LED chip (or array) area to LED package footprint can be lessthan six, while in other embodiments it can be less than five. In stillother embodiments it can be less than four, with some embodiments havinga ratio of approximately 3.5. In one embodiment according to the presentinvention that is the same or similar to the LED package 50 shown inFIGS. 4 through 9 and described above, the LED chip 52 can beapproximately 850 μm square, with the LED package footprint beingapproximately 1.6 mm square. This results in an LED chip area to LEDpackage footprint of approximately 3.54. In some multiple LEDembodiments as described below, this ratio can be less than 3.

In still other embodiments, the submount area for LED packages having asingle LED as well as those having multiple LED the submount footprintcan be as low as the LED area plus 2 times the conversion material layerthickness at the edge of the submount. In embodiment having a single 1mm LED, the submount area can be as low as 1.21 mm, resulting in a ratioof LED chip area to LED package footprint of 1.21. In multiple LED chipembodiments, such as those with chips placed edge to edge, the sameratios are can be reached. Different ratios can also be achieved withsubmounts having different shapes. In embodiments having 16 DA240 LEDsmounted on a rectangular submount having one side length 16 time 0.240mm plus 2 time 0.05 mm, while the other would be 16 times 0.320 mm plus2 times 0.05 mm. The ratio the ratio of LED chip (or array) area to LEDpackage footprint in these embodiments can be as low as approximate1.046.

In still other embodiments, the ratio can be as high as 20 or more. Indifferent embodiments, the ratio can fall in the range of 1 to 20, 1 to15, 1 to 10, 1 to 5, 1 to 3, or 1 to 2. In embodiments having two DA240LEDs on a 1.6 mm submount the ratio of LED area to submount footprint isapproximately 16.67. This same improved ratio is applicable to LEDpackages with smaller or larger footprints. The present invention alsoallows for these packages to exhibit the same improved ratio, but havinglarger or smaller area LED chips as the case may be.

By having greater LED area for package footprint, the LED packages canbe used in place of conventional LED packages, and for the same amountof area can provide greater LED emission area. In many applications,this allows for driving the same area of LED packages with a lower drivesignal to achieve the same emission intensity. Similarly, the same drivecurrent can be used, and the LED packages according to the presentinvention can be used to generate higher emission intensity.

The embodiments according to the present invention can also havedifferent combinations of footprint ratio dimensions to heightdimensions. In some embodiments, the ratio of footprint dimensions canbe 1 by 1, with a corresponding height ratio of less than one. In someembodiments, the LED packages can have a footprint measuring 1.6 by 1.6,with a height of approximately 1.3 mm, giving dimension ratios of 1 by 1by approximately 0.8125. In still other embodiments, the ratio offootprint to height can be approximately 1 by 1 by 1 with someembodiments having footprint measuring 1.6 mm by 1.6 mm, and having aheight of approximately 1.6 mm. Other embodiments can comprise a ratioof 1 by 1 by greater than 1, and other embodiments can have a dimensionof 1 by 1 by greater than 1.5. Still other embodiments can havedimensions of 1 by 1 by greater than 1.5 or greater, or 1 by 1 by 2 orgreater, or 1 by 1 by 3 or greater.

Other embodiments according to the present invention can have differentencapsulant heights, with this height being measured from the bottom ortop surface of the submount. In some embodiments, the height of theencapsulant can be as low as 0.3 mm to as high as 5 mm or more. In stillother embodiments, the encapsulant can be 2 mm high or more. In stillother embodiments, it can be 1 mm high or more. It is noted that in someembodiments, the emission pattern of the packages can change with theheight of the encapsulant, with some embodiments having a wider emissionpattern for higher encapsulants. For example, the in embodiments havinga single LED and cubic encapsulants, emission pattern for a packagehaving a 0.625 mm high encapsulant (measured from the top surface of thesubmount) can have an emission pattern that is approximately 8% widerthan the same package with a 0.525 mm encapsulant. For a package with a0.725 mm encapsulant, the emission pattern width can be increasedfurther, up to approximately 5% wide. This increased emission patterncan be realized with higher encapsulants, without significant variationsin emission efficiency.

The different LED package embodiments can operate from different drivesignals, with some operating from signals as low as 50 mWatts to severaltens of Watts. In some embodiments, the drive signal can be in the rangeof 500 mWatts to approximately 2 Watts. The different embodiments canalso provide different luminous flux output, with some embodimentsemitting 100 lumens or more. Other embodiments can emit 110 lumens ormore, while other embodiments can emit 150 lumens or more. Differentembodiments can also emit different color temperatures in the range of2000 to 6000K, with some embodiments emitting approximately 3000K andothers approximately 5000K. By way of example, an LED package accordingto the present invention having a package footprint of 1.6 by 1.6 mm,can emit approximately 120 lumens at a temperature of 3000K. Otherembodiments having the same size can emit 140 lumens at 5000K. The areafor the package footprint is 2.56 mm² resulting in emission of 47lumens/mm² at 3000K, and 55 lumens/mm² at 5000K. Different packagesaccording to the present invention can generally emit in the range of 35to lumens/mm². Packages that are approximately 1.6 mm tall can have avolume of approximately 4.096 mm³, resulting in operation atapproximately 29.27 lumens/mm³ at 3000K and 34.18 lumens/mm³ at 5000K.Different packages according to the present invention can generally emitin the range of 20 to 45 lumens/mm³. This can vary depending on thedrive signal (or drive current) but does, however, result in anoperation of 115 lumens per Watt (LPW) at 3000K, and 135LPW at 5000K.Other embodiments having different drive signals can also exhibitsimilar LPW operation at the same color temperature. The range of LPWfor the different embodiments can generally be in the range of 100 to150LPW.

It is understood that many that different LED packages can havedifferent sized footprints beyond those mentioned above, with somehaving footprints larger than 2.5 mm². In some embodiments, thefootprint can be up to 3.5 mm² or larger. These different footprints canbe arranged to hold different sized LED chips. For example, an LEDpackage with a 1.6 mm² footprint can hold an LED chip that is up to0.950 mm across, while an LED package with a 2.5 mm² footprint can holdan LED chip that is up to 1.35 mm across. An LED package with a 3.5 mm²footprint can hold an LED chip that is up to 1.950 mm across. These areonly a few examples of footprint and LED chip size combinations that canbe used in LED packages according to the present invention.

As discussed above, different packages according to the presentinvention can have more than one LED as their light source. FIGS. 20through 27 show another embodiment of an LED package 150 according tothe present invention comprising a submount 54, conversion materiallayer 56, encapsulant 58, solder pads 60 a, 60 b and conductive vias 62a, 62 b. In this embodiment, the light source comprises first and secondLEDs 152 a, 152 b mounted to first and second die attach pads 154 a, 154b on the submount. The LEDs 152 a, 152 b can comprise many differentcommercially available LEDs such as those described above, with someembodiments utilizing DA350 LEDs commercially available from Cree, Inc.The LEDs 152 a, 152 b can have different dimensions, with some,embodiments being approximately 350 μm by 470 μm.

The die attach pads 154 a, 154 b can be made of the same materials asdescribed above and can be deposited using the same methods. In thisembodiment the first die attach pad 154 a is U-shaped and the second dieattach pad 154 b is elongated and is arranged between the legs of thefirst die attach pad 154 a. A space is provided between the first andsecond attach pads 154 a, 154 b with each of the LEDs 152 a, 152 bmounted to the first and second attach pads 154 a, 154 b and eachspanning the space between two. The LEDs 152 a, 152 b can be mounted indifferent locations on attach pads 154 a, 154 b, with the first LED 152a mounted generally in one corner of the submount 54, and the second LEDmounted at the opposite corner of the submount 54. During operation, anelectrical signal is applied to the solder pads 60 a, 60 b that istransmitted to the attach pads 154 a, 154 b through the vias 62 a, 62 b.The signal is then transmitted to the LEDs 152 a, 152 b causing them toemit light. The LED package operates in much the same way as LED package50, and can have the same sizes and ratios described above.

FIGS. 28 through 35 show another embodiment of an LED package 160according to the present invention comprising a submount 54, conversionmaterial layer 56, encapsulant 58, solder pads 60 a, 60 b,conductivevias 62 a, 62 b, and die attach pads 154 a, 154 b similar to those inLED package 150 described above. In this embodiment, the LED packagelight source comprises first, second and third LEDs 162 a, 162 b, 162 cwith each of the LEDs mounted to the attach pads 154 a, 154 b across thespace between the two. The LEDs can be mounted in many differentlocations, with first and second LEDs 162 a, 162 b mounted along one legof attach pad 154 a, and third LED 162 c mounted along the other leg.The third LED 162 c is generally aligned with the space between thefirst and second LEDs 162 a, 162 b, but it is understood that the LEDscan be mounted in relation to each other in many different ways. The LEDpackage 160 operates in much the same way as the LEDs packages describedabove, and can have the same size and dimension ratios.

The LED packages 150 and 160 have multiple LEDs electrically connectedin parallel, but it is understood that the LEDs can also be connected inseries. For packages having a plurality of LEDs, the LEDs can beconnected in different parallel and series combination. Different seriesconnected LEDs can be separately controlled (i.e. independentlyaddressable) and in these embodiments the submount can comprise morethan two solder pads so that multiple signals can be applied to the LEDchip.

As mentioned above, these LED packages can be arranged to operate fromdifferent voltages including but not limited to 3V, 6V, 12V or 24v. Thepackages may also have chips connected in series or parallel, and emitdifferent colors of light beyond white, such as blue, green, red,red-orange, etc. Each of these can be multiple chip embodiments coupledtogether in different ways. Some embodiments can emit one of thesecolors of light and can comprise 2 or 3 LEDs coupled together inparallel and operating from a 3V signal. Other embodiments can comprise2 LED coupled in series such that the LED package operated from a 6Vsignal. Both these can be formed on different submounts, such as thosemade of alumina. Other embodiments can comprise 4 LED chips in seriesthat are arranged to operate from 12V. These embodiments can be onsubmounts made of different material such as aluminum nitride (AlN) orsapphire (Al₂O₃). Still other embodiments can comprise four LEDsemitting the same color (e.g. red) and coupled two parallel strings oftwo LEDs in series. These embodiments can be arranged to operate from a6v signal and can be on submounts such as alumina.

FIG. 36 shows one embodiment of a submount 170 according to the presentinvention with first, second and third die attach pads 172 a, 172 b, 172c, first and second conductive vias 174 a, 174 b, and first and secondLEDs 176 a, 176 b. Many different commercially available LEDs can beused such as the DA350 LED chip described above. In this embodiment, thefirst attach pad 172 a is connected to the first conductive via 174 a,and the third die attach pad 172 c is connected to the second conductivevias 174 b. The second die attach pad 172 b is not connected to a vias.The first LED 176 a is mounted across the first and second attach pads172 a, 172 b, and the second LED 176 b is connected across the secondand third die attach pads 172 b, 172 c. This results in a seriesconnection of the first and second LEDs 176 a, 176 b, with an electricalsignal on the first vias 174 a conducting into the first die attach pad172 a, then through the first LED 176 a, then into the second die attachpad 172 b, then through the second LED 176 b, and finally into the thirddie attach pad 172 c. Using 3 volt LEDs, this embodiment can utilize a 6volt drive signal, but the drive voltage can be different depending onthe LED voltage.

FIG. 37 shows another embodiment a submount 180 that is similar to thesubmount 170 shown in FIG. 36 and comprises first, second and third dieattach pads 182 a, 182 b, 182 c, first and second conductive, vias 184a, 184 b, and first through sixth LEDs 186 a, 186 b, 186 c, 186 d, 186e, 186 f. The first through third LEDs 186 a, 186 b, 186 c are mountedacross the first and second attach pads 182 a, 182 b, and the fourththrough sixth LEDs 186 d, 186 e, 186 f are mounted across the second andthird die attach pads 182 b, 182 c. This results in a series/parallelconnection of the LEDs with the first group of first through third LEDs186 a, 186 b, 186 c connected in parallel the second group of fourththrough sixth LEDs 186 d, 186 e, 186 f also mounted in parallel. Thefirst and second groups are connected in series. An electrical signal onthe first vias 184 a conducting into the first die attach pad 182 a,then through the first group, then into the second die attach pad 182 b,then through the second group, and finally into the third die attach pad172 c. Using 3 volt LEDs, this embodiment can utilize a 6 volt drivesignal, but this can be different as mentioned above.

FIG. 38 shows still another embodiment of and submount 190 having a dieattach pattern 192 that can be used to connect up to six LEDs (notshown) in series, with each of the LEDs being mounted across the spacebetween adjacent elements of the pattern 192. This embodiment can have adrive signal of up to approximately 18 volts for 3 volt LEDs. This drivesignal can be less for LED packages having fewer than six LEDs or whenusing lower voltage LEDs, and can be more if using higher voltage LEDs.FIG. 39 shows another embodiment of an submount 200 having first andsecond interdigitated U shaped die attach pads 202 a, 202 b that arearranged for the mounting of up to 6 LEDs, although the submount canalso hold fewer LEDs. Each of the LEDs is mounted across the spacebetween the first and second attach pads 202 a, 202 b so that the LEDsare connected in parallel such that a drive signal of 3 volts can beused. Like above, this drive signal can be higher or lower depending onvoltage for the particular LED being used. The embodiments in FIGS. 38and 39 can use different LEDs such as DA350 LEDs described above. Inthis arrangement on a LED package with a footprint of 1.6 mm by 1.6 mm,the chip area to footprint ratio can be below 3 and in some embodimentsapproximately 2.59.

Other embodiments can be arranged to hold even more LEDs. FIG. 40 showsstill another embodiment of and submount 210 having a die attach pattern212 that can be used to connect up to sixteen LEDs (not shown) inseries, with each of the LEDs being mounted across the space betweenadjacent elements of the pattern 192. In embodiments utilizing 3 voltLEDs, a 48 volt drive signal can be used. Like above, this driver signalcan be higher or lower, depending on the voltage and number of LEDsmounted to the submount. FIG. 41 shows still another embodiment of ansubmount 220 comprising a first U-shaped attach pad 222 a,interdigitated with a second W-shaped attach pad 222 b such that up to16 LEDs can be connected in parallel. As with the embodiment above, eachof the LEDs can be mounted across the space between the first and secondattach pads 222 a, 222 b. Using 3 volt devices, this package can utilizea 3 volt drive signal, with this signal being higher or lower asdiscussed above. The embodiments in FIGS. 40 and 41 can use differentLEDs as described above. The embodiment shown is particularly arrangedfor using DA240 LEDs commercially available from Cree that have an areaof 240 μm by 320 μm. In a package with a 1.6 mm by 1.6 mm footprint, thechip area to package footprint ratio can be approximately 2.13, but itis understood that the ratios mentioned herein could be differentdepending on a number of factors, such as the size of the LEDs, thenumber of LEDs, size of the submount, etc.

It is noted that the LED in multiple LED package embodiments, it may beadvantageous to place the LEDs as close as possible to the edge of thesubmount. This may be particularly true when using the LED packages in alinear arrangement such as in a LED based fluorescent lighting tubearrangement. For example, for the two LED embodiments described herein,it may be advantageous to place the LEDs at opposing corners on thesubmount.

As mentioned above, the encapsulant can be formed in the LED packagesaccording to the present invention using different methods, with someembodiments using different molding processes. One such molding processis referred to as compression molding wherein a mold is provided havinga plurality of cavities each of which has an inverted shape of the lens.FIG. 42 shows one embodiment of a mold 230 with a plurality of cavities232. During molding of the lenses, a submount panel is provided that canhave an area approximately the same as that covered by the cavities 232.It is understood that submounts covering less than all the cavities canalso be used. The submount panel can comprise a plurality of LEDs (orsets of multiple LEDs) and each of the cavities 232 is arranged to alignwith a respective one of the LEDs (or a set of LEDs) on the submountpanel. The mold is loaded with an encapsulant material in liquid formfilling the cavities, with some embodiments utilizing a liquid curablesilicone. The submount panel can be moved toward the cavity with each ofthe LEDs (or set of LEDs) being embedded in the liquid silicone withinone of the respective cavities. The liquid silicone can then be curedusing known curing processes. The panel can then be removed from themold and the panel can comprise a plurality of encapsulants in the shapeof the cavities, each of which is over a respective one of the LEDs. Theindividual LED packages can then be separated or singulated from thesubmount panel, using known techniques.

Referring again to the embodiment described above, and in particular theLED package 150 shown in FIGS. 4 through 13, a small encapsulantconnection section 69 is provided at the base of the encapsulant 58.This is a byproduct of the molding process. The cavities in the moldingprocess may not extend to the top surface of the submount 54, therebyleaving the encapsulant section between adjacent ones of the LEDpackages. The singulation process cuts through the connection section 69and the submount 54 when separating the LED packages.

It is understood that other fabrication processes can be used with onesuch process comprising covering of a submount panel and its LEDs with alayer of encapsulant material. The individual LED packages can then beseparated by different methods such as dicing or cutting through theencapsulant and submount. The resulting packages can have encapsulantside surfaces that are approximately vertical and aligned with the edgesof the submount. In still other embodiments, the encapsulants can beseparately molded and then attached to the submount over phosphorconversion material layer. It is understood that the surfaces of theencapsulants can be smoothed or further shaped using different methods,such a cutting, grinding, sanding or etching.

As mentioned above, embodiments according to the present invention canhave relatively smooth planar surfaces to enhance TIR. The surfacesshould be smooth enough such that the LED is clearly visible through theencapsulant. Stated differently, there, is little or no roughness on thesurface of the encapsulant to obscure or redirect the light rays passingthrough the encapsulant. In some embodiments where there is sometexturing, roughness or imperfections on the surfaces of theencapsulant, either intentionally included or the result ofmanufacturing processes. For these embodiments, it can be preferablethat these surface features be of the size that does not significantlyscatter light. In some embodiments, surface features of sizes having aroot mean square (RMS) close to or greater than the wavelength of lightencountering the surface. Feature sizes having an RMS greater than thewavelength of light tend to scatter less light, while feature sizeshaving an RMS less than the wavelength of light tend to scatter more ofthe light. For embodiments where blue light encounters the surface, thesurface features can have an RMS of or greater than approximately 500nanometers, to minimize scattering. This RMS value can change dependingon the wavelength of light encountering the encapsulant surface.

FIGS. 43 through 46 show another embodiment of an LED package 240according to the present invention having approximately vertical sidesurfaces 242 that are approximately aligned with the edges of thesubmount 244. This embodiment also has a polarity indicator thatcomprises a notch 246 in the corner of the solder pad 248. Again, thisis only one of the many different types of polarity indicators that canbe included in the embodiments of the present invention.

The LED packages can also be used in many other lighting applicationssuch as LED displays, LED street lighting, residential LED downlighting,etc. Some LED package embodiments of the present invention areparticularly applicable to fluorescent tube replacement LED lightingwith the emission pattern of the LED packages being desirable for lineararrays such as those used in fluorescent tube replacements. FIG. 47 isgraph 300 showing the first and second plots 302, 304 with the firstplot 302 showing performance (lumens per watt verses input power) of LEDpackage embodiments according to the present invention that have 2 LEDsand whose emission pattern can be desirable for fluorescent replacementtubes. The LED package can include many different LEDs with someembodiments comprising two DA350 LEDs as described above. The secondplot 304 shows performance (lumens per watt verses input power) of asecond LED package according to the present invention that have a singleLED and whose emission pattern may also be desirable. Many differentsingle LEDs can be used, such as one DA850 as described above. The firstand second highlighted portions 306, 308 show operating performance forthese devices as might be found in 21 watt and a 31 watt fluorescentreplacement tube operation, respectively. FIG. 48 is a graph 310 alsoshowing first and second plots 312, 314, with plot 312 showingadditional performance (lumens per watt verses current density) data fora the first LED package, and plot 314 showing the performance data forthe second LED package.

The LED packages can be arranged with many different features beyondthose described above. Some embodiments can comprise electrostaticdischarge (ESD) protection elements or devices. Others of the LEDpackages can be arranged with secondary optics to further shape thepackage beam profile.

LED packages according to the present invention can comprise one or moreLEDs that can have many different shapes and sizes beyond thosedescribed above, and can have many different features. FIGS. 49 and 50show another embodiment of an LED package 350 according to the presentinvention that is similar to the LED package 50 shown in FIGS. 4-9 anddescribed above. The LED package 350 comprises a submount 54,encapsulant 58 and conversion material layer 58. These elements aresimilar to corresponding elements described above and can comprise thesame materials arranged as described above. In this embodiment, however,comprises an LED 352 can comprise features to enhance light extractionsuch as a textured top surface 354. Each of LEDs 352 can also comprise acurrent spreading structure 356 to spread current into the top surfaceof the LED 352. In some embodiments, wire bonds (not shown) can beincluded for conducting an electrical signal from the die attach pads orconductive traces on the submount, to the current spreading structure.

Many different LEDs can be used for the first LED 352, with someembodiments utilizing commercially available LEDS such as those in theEZ family of LEDs from Cree, Inc. These LEDs 352 provide a textured topsurface that is generally parallel to the top surface of the encapsulant58, and side surfaces that are generally parallel to the side surface ofthe encapsulant 58, although in other embodiments these surfaces can beoblique to their corresponding surfaces. It is understood that othersurfaces of the LEDs 352 can be textured and that for all surfacesdifferent features can be included that enhance light extraction. It isunderstood that LEDs 352 can be included in many different LED packagesarranged in different ways, with some embodiments having horizontal andvertical planar surfaces as described above.

FIGS. 51 and 52 show another embodiment of an LED package 370 accordingto the present invention comprising a submount 54, with a conversionmaterial layer 56 and an encapsulant 58. This embodiment comprises anLED 372 having can be rectangular shaped footprint with side surfacesthat are at least partially angled such that the at least part of theside surfaces are oblique to the side surface of the encapsulant 58. Inthis embodiment the LED side surfaces are angled such that the lowerportion of the LEDs 372 is smaller than the upper portion. This resultsin the distance from the side surface of the encapsulant 58 increasingmoving down the side surface of the LEDs 372. Many different LEDs can beused with a rectangular footprint, such as those commercially availablefrom Cree, Inc., under its TR family of LEDs. These LEDs 372 can be usedin many different LED packages shapes and arranged as described above,including those with encapsulants having horizontal and verticalsidewalls.

FIGS. 53 and 54 show an LED package 390 according to the presentinvention having a submount 54, conversion material layer 56 and anencapsulant 58. Further comprises an LED 392 having a square shapedfootprint with side surfaces that are at least partially angled suchthat the at least part of the side surfaces are oblique to the sidesurface of the encapsulant 58. Like the embodiment above, the LED sidesurfaces are angled such that the lower portion of the LEDs 392 issmaller than the upper portion. This results in the distance from theside surface of the encapsulant 58 increasing moving down the sidesurface of the LEDs 392. Many different LEDs can be used for the LEDs392, such as those commercially available from Cree, Inc., under itsUltra Thin family of LED chips.

FIGS. 55 and 56 show another embodiment of an LED package 410 accordingto the present invention also comprising a submount 54, a conversionmaterial layer 56 and an encapsulant 58. The LED package 410 furthercomprises LED 412 that has a generally square footprint and side and topsurfaces that are generally parallel to the side and top surface of theencapsulant 58. Many different types of LEDs can be used with thisfootprint and shape, such as those having a substrates made out ofinsulating materials such sapphire. The LEDs 412 can also comprise otherfeatures, such as wire bonds or light extraction features (not shown).These LEDs can also be used in different types of LED packages such asthose with planar side and top surfaces.

It is further understood that different types of LEDs can be used indifferent package embodiments having multiple LEDs, and the packages canhave different numbers of LEDs arranged in different ways. FIGS. 57 and58 show another embodiment of an LED package 430 according to thepresent invention that is similar to the LED package 160 shown in FIGS.28-33 and described above. The LED package comprises a submount 54, anconversion material layer 56 and an encapsulant 58. LED package 430comprises three LEDs 432, each of which can be similar to the LED 325shown in FIG. 49 and described above. Each of the LEDs can comprise atextured top surface 434 and a current spreading structure 436, and eachcan emit the same or different wavelengths of light. FIGS. 59 and 60show another embodiment of an LED package 450 with three LEDs 452 thatare similar to the LED 392 shown in FIGS. 53 and 54, and FIGS. 61 and 62show still another embodiment of an LED package 470 according to thepresent invention having three LEDs 472 that are similar to LED 412shown in FIGS. 55 and 56.

Different LED package embodiments can also have different types of LEDsin the same package to achieve the desired emission profile with somehaving different combinations of LEDs with parallel surfaces, obliquesurfaces and/or textured surfaces. FIGS. 63 and 64 show a furtherembodiment of an LED package 490 according to the present inventionhaving first, second and third LEDs 492, 494, 496 each of which is adifferent from the others. This is only one of the many different LEDcombinations that can be utilized in LED packages according to thepresent invention, and it is understood that different packages can havedifferent numbers of LEDs having different shapes and sizes. Each of theLEDs 492, 494, 496 can have many different features such as wire bonds,current spreading structures and light extraction features (not shown).This is only one of the many different combinations that can be usedaccording to the present invention. These different combinations canalso be used in any of the different types and shapes of LED packagesdescribed above, and with packages having planar surfaces such as sideand top surfaces.

It is understood that different multichip embodiments according to thepresent invention can be arranged in many different ways, with manydifferent types of LEDs that can emit different or same colors of light.For LED packages with LEDs emitting different colors of light, thepackages can emit the desired combination of light from the LEDs.

FIGS. 65 through 69 show one embodiment of an LED package 550 accordingto the present invention comprising LEDs 552, mounted on a submount 554.The LED package 550, can also comprises first, second, third and fourthcontact/solder pads 560 a-d on the bottom of the submount 554, first,second, third and fourth conductive vias 562 a-d passing through thesubmount 554. The vias are arranged to conduct an electrical signal todie attach pads (not shown herein but described in more detail below) onthe top surface of the submount 554. The LED package further comprises aconversion material layer 556 (best shown in FIG. 68) covering at leastsome of the LEDs 552, the exposed surfaces of the die attach pads, andexposed portions of the top surface of the submount 554. An encapsulant558 is included over the submount 554 with the LEDs 552 and the dieattach pads between the submount 554 and the encapsulant 558. The abovefeatures of the LED package are described in detail below.

The LEDs 552 can comprise different LEDs emitting at differentwavelengths of light, and in the embodiment shown the LEDs 552 cancomprise four blue emitting LEDs 552 a and red emitting LEDs 552 b. Itis understood that different numbers of the LEDs can be used and inother embodiments different types of LEDs can be used. Many differentLEDs can be used such as those described above, including LEDscommercially available from Cree Inc., under its DA, EZ, GaN, MB, RT,TR, UT and XT families of LED chips. LED substrate materials may besilicon carbide (SiC), sapphire, gallium nitride (GaN) or others. TheLED package 550 is particularly arranged for use of blue emitting LEDsfrom the DA family of chips described above that can be flip chipmounted to the submount with wire-free bonding. Commercially availablered LEDs 552 b can be used with these blue emitting LEDs. It isunderstood that in some embodiments the LEDs 552 a, 552 b can beprovided following removal of its growth substrate. In otherembodiments, the LED's growth substrate can remain on the LEDs 552 a,552 b with some of these embodiments having a shaped or textured growthsubstrate.

In other embodiments, more or fewer LEDs can be used as the lightsource, while in other embodiments solid state lasers can be used incombination with one or more LEDs. In some embodiments, the LEDs cancomprise a transparent growth substrate such as silicon carbide,sapphire, GaN, GaP, etc. The LED chips can also comprise a threedimensional structure or geometry, and in some embodiments the LEDs canhave structure comprising entirely or partially oblique facets on one ormore surfaces of the chip.

The LEDs 552 a, 552 b are mounted to die attach pads on the submount554. The submount 554 can be formed of many different materials asdescribed above and can be arranged in many different ways. The topsurface of the submount 554 has a top planar surface with the die attachpads comprising patterned conductive features that can also includeconductive traces. The die attach pads can be arranged in manyconventional ways and can be arranged in the same way as the die attachpads and conductive traces described above. In the embodiment shown, theLEDs can be mounted to the attach pads such that each spans a spacebetween adjacent ones of the attach pads. Different die attach padpatterns or arrangements can be used and in some embodiments the sameelectrical signal can be applied to all the LED chips. In otherembodiments the attach pads can be arranged to allow for differentsignals to be applied to different ones of the LED chips. Many differentmounting methods can be used for mounting the LED chips 552 a, 552 b tothe die attach pads, such as methods utilizing conventional soldermaterials. The LED chips can also be electrically connected to theattach pads or other conductive traces using known surface mount or wirebonding methods, depending on the geometry of the LED chips 552. Thesolder pads 560 a-d, conductive vias 562 a-d, and attach pads cancomprise many different materials, such as those described above.

A space or gap is provided between the solder pads 560 a-d to minimizethe chance of electrical shorting between the pads. In the embodimentshown, the space between the pads can be in the range of 400 to 600 μm,with the embodiment shown having a space of approximately 500 μm. Inother embodiments, the solder pads can be thinner, which can allow for asmaller space between the pads 560 a-d. In other embodiments, the spacecan be less than 400 μm, while in other embodiments it can be less than300 μm. In still other embodiments is can be less than 200 μm, with somehaving solder pads thin enough to provide for a spacing of approximately50 μm.

In the embodiment shown, the solder pads 560 a-d are substantiallysquare shaped and are arranged in the corners of the submount 554. It isunderstood, however, that in other embodiments the solder pads can havedifferent shapes and can be arranged in different locations. Forexample, in some embodiments the solder pads can have a rectangularshape and can be arranged in different locations around the edge of thesubmount to maximize the spacing between the electrodes. In otherembodiments, the solder pads can be triangular shaped and can be locatedin the corners of the submount to again maximize the space between theelectrodes. The solder pads can also have different shapes on the samesubmount, with some combining different shapes to most effectively spacethe solder pads. In these different embodiments, vias can still beprovided to conduct an electrical signal to the die attach pads.

In some embodiments, the attach pads can extend beyond the edge of theLEDs 552, as described above, to cover most of the top surface of thesubmount 554. This can help in thermal management for the LED package550 by spreading heat from the LEDs 552 into the pads so that heatspreads beyond the edge of the LEDs 552 into more area of the submount554. This allows the heat to be less localized and allows it to moreefficiently dissipate through the submount 554 into the ambient.

The conversion material layer 556 is included over the blue emittingLEDs 552 a, exposed portions of the attach pads, and exposed portions ofthe submount's top surface. The conversion material layer 556 can beapplied using different processes discussed above. In the embodimentshown, the red emitting LED 552 b may not be covered by the conversionmaterial layer, but it is understood that in other embodiments it couldbe covered by one or more conversion materials. The uncovered red LEDchips may present a surface that can absorb light instead of recyclinglight, but in the embodiments shown this absorbing surface can berelatively small compared to the overall area of the submount's topsurface such that it presents an acceptable amount of light absorption.

Many different conversion materials can be used in the conversionmaterial layer 556 to generate the desired LED package light emissionsuch as any of the conversion materials described above or combinationsthereof. The present invention can be particularly adapted to LEDpackages emitting white light. In some white emitting embodiments, theLED 552 can emit light in the blue wavelength spectrum. In otherembodiments the LED can emit light in the violet to UV part of thespectrum for example in the wavelength range between 360 nm and 440 nm.The conversion material can be of the type that absorbs blue light orother wavelength light and re-emits for instance yellow light such thatthe package emits a white light combination of blue and yellow light. Indifferent embodiments, the conversion material can comprise manydifferent types, including but not limited to the conversion materialsmentioned above.

It is understood that more than one conversion material can be used indifferent LED packages having different types of emitter. In someembodiments, the number and type of conversion materials can bedependent on the emission wavelength of the solid state light source.For example, the conversion material layer can comprise at least threephosphors covering parts or all of the visible wavelength range, withsome embodiments comprising a combination of yellow, red and greenphosphors. For violet and UV emitting solid state light sources a bluephosphor may be added. Other combinations are possible, and otherembodiments can comprise more than three phosphors. Many differentyellow, red and green phosphors can be used, such as those describedabove.

The conversion material can comprise different sized phosphor particlesin the ranges discussed above and the conversion material can be fixedin the conversion material layer in a binder. The binder can comprisethe materials listed above, among others, and the phosphor can beprovided in different concentrations in the binder as also discussedabove. The conversion material layer 556 can also have different regionswith different concentrations of phosphor particles. Alternatewavelength conversion materials may also be used to down-convert lightto generate white emissions. Such materials may be, but are not limitedto organic fluorescent materials or dyes or inorganic quantum dotmaterials such as CdSe/ZnS, InP/InAs, CdS/CdSe, CdTe/CdSe or others.Like above, the conversion material layer 556 can also have manydifferent thicknesses depending at least partially on the concentrationof the conversion material, the size of the conversion materialparticles, and the desired amount of light to be converted by theconversion material. Thickness may also vary across the layer, withdifferent regions having different thicknesses.

Like the embodiment discussed above, the different packages according tothe present invention can comprise conversion layers with less phosphormaterial (e.g. thinner or lower concentration) compared to similarpackages with hemispheric encapsulants, while still maintaining thedesired emission color point. This reduction in thickness depends onmany different factors, such as the phosphor type, size of phosphorparticles, and concentration of phosphor particles in the layer. In someembodiments, the reduction can be 10% or more compared to a similar LEDpackage with hemispheric lens. In still other embodiments it can be 20%or more, while in other embodiments it can be 30% or more.

Referring to FIGS. 65 through 69, encapsulant 558 is included on theconversion material layer 556, and over the LEDs 552 and submount 554,with the encapsulant 558 providing environmental and mechanicalprotection, as well as allowing for the recycling of light as describedabove and described in more detail below. Like the embodiments above,the encapsulant 558 has planar surfaces, and in the embodiment shown theencapsulant 558 has a generally cubic shape. It is understood thatencapsulant can take many different shapes, such as those describedabove, including triangle, pentagon, hexagon, octagon, etc., and shapesthat comprise vertical surfaces numbering in the range of 3 to 12 ormore. In still other embodiments, the encapsulant can be cylindricalwith different cross sections such as circular or oval.

It is understood that encapsulant 558 and the LEDs 552 can be aligned inmany different ways, with the embodiment shown having its red LED 552 bas shown approximately aligned with the center or longitudinal axis ofthe encapsulant 558. The blue (or BSY) LED chips 552 a can be at thecorners of the submount 554 and the encapsulant 558. It is understoodthat this is only one of the many different patterns for the LED chips,with some having random placement of different emitting LED chips andothers can have an organized pattern of different emitting LED chips.

Many different materials can be used for the encapsulant 558 such asthose described above, and the encapsulant can have properties similarto the encapsulants described above. In different embodiments, theencapsulant can have many different thicknesses as described above, andin some embodiments, the top surface of the encapsulant can have aslightly smaller area than the bottom of the encapsulant and/or thefootprint of the LED package. In still other embodiments, the upperportions of the encapsulant can have a larger area than lower portions,or a larger area than the LED package footprint.

The solder pads 560 a-d are formed on the bottom surface of the submount554, and can be used for mounting the LED package 552 in place usingknown mounting methods, and for applying one or more electrical signalsto the LED package. The embodiment shown comprises four contact pads 560a-d, that allow for different electrical signals to be applied to theLED package 550 to control the emission intensity of different ones ofthe blue and red LED chips 552 a, 552 b. In some embodiments, two of thesolder pads can be used to apply an electrical signal to the blueemitting LEDs 552 a, and the other two can be used to apply anelectrical signal to the red emitting LED 552 b. This allows forrespective control of the emission intensity for the blue and redemitting LEDs 552 a, 552 b. It is understood that in other embodiments(as described below), LED packages according to the present inventioncan have two solder pads so that all the LED chips are responsive to thesame electrical signal, or can have more than two solder pads to allowfor more control over the emission of respective ones of the LEDs 552 a,552 b.

The solder pads 560 can be made of the same materials and can be formedin the same way as die attach pads. Like the embodiments above,conductive vias 562 a-d can pass through the submount 554 with the viasbeing formed of a conductive material such as those used for the dieattach pads and solder pads 560 a-d. Like the embodiments above, thevias are arranged to provide an electrically conductive path between thesolder pads 560 a-d and the die attach pads. The embodiment showncomprises four vias, with each providing a conductive path between arespective one of the solder pads 560 a-d, and a respective one of theattach pads. This allows for an electrical signal applied to the solderpads 560 a-d to be conducted through the submount 554 along the vias 562a-d, to the die attach pads. The signal is then conducted to the desiredone of the LEDs 552 a, 552 b, causing it to emit light. It is understoodthat in other embodiments the electrical signal can be transmitted tothe LED in other ways such as through conductive traces or wire bondpads arranged in different locations in the LED package, and runningbetween the mounting surface or the submount, and the LED.

Like the embodiments above, the LED package 550 provides improvedstructures for providing polarity indication by forming one or moreindication notches 566 in one of the solder pads. A notch 566 can beformed in the corner of the solder pad 560 c that can be detected withup-looking cameras in automated pick-and-place equipment duringmanufacturing. Like above, the polarity indicators can be in manydifferent locations, can have many different shapes, and can be arrangedin many different ways. Some embodiments according to the presentinvention can also comprise polarity indicators on the top surfaces ofthe LED package 550, similar to those discussed above, to show polaritywhen viewing the LED packages 50 from the top.

Like the embodiments above, the LED package 550 can be arranged toutilize TIR light within the encapsulant to increase light emissionefficiency. The encapsulant can be arranged to promote at least some TIRlight within the encapsulant compared to conventional LED packageshaving encapsulants to minimize TIR light. It is believed that byproviding a blanket conversion material layer over the top surfacesunder the encapsulant 558, including the blue LED 552 a, areas of thedie attach pads around the LED 552, and the top surface of the submount554 exposed around the LED 552, this expected any efficiency loss fromTIR can be minimized or eliminated. The blanket conversion materiallayer can also scatter light to allow the TIR to escape from theencapsulant on a subsequent pass, and can also provide an improved LEDemission pattern.

Referring now to FIG. 70, an exemplary LED package 590 according to theinvention is shown with sample blue, yellow and red light traces 592,594, 596. The LED package 590 comprises many of the same or similarfeatures to those in LED package 550, and for those features the samereference numbers will be used herein. The LED package 590 comprises andblue emitting LEDs 552 a, red emitting LEDS 552 b, submount 554,conversion material layer 556, and an encapsulant 558. The LED package590 can be arranged to emit different colors of light, and in theembodiment shown the LED chips 552 a, 552 b emits blue and red light,and the conversion material layer 556 comprises a conversion materialthat converts some of the blue light to yellow light. This results inblue, yellow and red light passing through the encapsulant and reachingits surface. Referring to the blue light trace 592, a portion of theblue light passes through the conversion material layer 556 andexperiences TIR when it reaches the surface of the encapsulant 558.Other portions of the blue light 592 pass out of the encapsulant tocontribute to emission from the LED package.

The blue TIR light reflects within the encapsulant and is eventuallydirected back toward the submount 554. Instead of reaching a lightabsorbing portion of the LED package, the TIR reaches the conversionmaterial layer 556. This blue light has already passed through theconversion layer 556, and following TIR the blue LED light encountersthe conversion material layer a second time. As discussed above, thiscan be referred to as “recycling” of the blue light that results inillumination of the top surface of the conversion material layer 556such that both sides of the layer are illuminated by blue light duringoperation. The conversion material layer 556 provides a “blanket” effectthat helps limit both blue and yellow light from re-entering the chip orhitting absorbing regions. When the blue light 592 hits the conversionmaterial layer 556 a second time, all or a portion of the light will bescattered or absorbed by the conversion material in the layer andre-emitted as yellow light. The re-emission will be omnidirectional orisotropic such that a portion of the TIR light will be redirected sothat it emits from the LED package. This omnidirectional reemissionamounts to scattering of otherwise TIR light to allow for the light toreach the encapsulant surface within the critical angle and emit fromthe encapsulant.

When the blue light passes through the conversion material layer thefirst time, a portion of the blue light is converted to yellow light asshown in light trace 594. Red light also emits directly from the red LEDas shown in light trace 596. A portion of blue, yellow and red lightwill emit from the package on its first pass, while the remainder willexperience TIR. This light can also experience scattering when itencounters the conversion material layer a second time, increasing thelikelihood that some of the light will emit from the encapsulant andcontribute to overall emission. In the embodiment shown, the LED packageemits the desired white light combination of blue, yellow and red light.

Like the embodiments above, the result is that the TIR and recyclingallows for emission efficiencies of the LED packages according to thepresent invention to be similar to conventional hemispheric lensed LEDs.Embodiments of the present invention have reduced concentrations ofconversion material in the conversion material layer to achieve the samecolor point due to the recycling effect. This can allow for more bluelight to pass through the phosphor on the first pass. Since typicalconversion layers can scatter as well as convert blue light, a reducedthickness or concentration of conversion material on the chip can meanthat less of this first-pass blue light is scattered back into the LEDwhere it may be absorbed, thereby improving package efficiency. Thisfirst-pass blue light can then be converted and scattered when itreaches the conversion material layer 556 a second time. This scatteringallows for more light to escape from the LED package, while maintainingthe proper emission balance between blue and yellow (and red) light toachieve the desired color point. The different embodiments can comprise20-30% less conversion material and can be smaller compared toconventional LED packages, which can result in less costly LED packageswith the same or similar emission efficiencies.

In some embodiments, the scattering during recycling of the light canalso provide additional advantages of a broader emission profile asdiscussed above. This can result in the above mentioned increases in theemission pattern FWHM, with some of these embodiments also exhibitingless than 10% color variation at viewing angles of different ranges suchas −90 to +90 degrees.

Some embodiments of the present invention can have emission profilessimilar to those shown in FIG. 18 and discussed above. FIG. 71 is agraph 612 showing the first emission profile 613 for a LED packageaccording to the present invention when viewing the package fromdirectly above (i.e. 0 degrees) and moving the viewing angle through toapproximately 100 degrees. Profiles 614, 615 and 616 show emissionprofiles starting from 45, 90 and 135 degrees. As mentioned above,scattering materials may be added to the encapsulant to further increasethe width of the emission profile and improve color uniformity withminimal impact on package efficiency. The LED packages according to thepresent invention can also emit light with more uniform color emissionat different viewing angles as discussed above. FIG. 72 is a graph 620showing variations in color temperature over viewing angle for oneembodiment of an LED package according to the present invention. Thevariations over viewing angles are from −100 to +100 degrees and aregenerally in the range of −100 to +200 Kelvin. The first emissionprofile 622 for an LED package according to the present invention whenviewing the package from directly above (i.e. 0 degrees) and moving theviewing angle through to approximately 100 degrees. Profiles 624, 626and 628 show emission profiles starting from 45, 90 and 135 degrees. Theblanketing of the conversion material layer can also allow for theconversion material layer to act as a remote layer with good thermalspreading as discussed above.

Some embodiments according to the present invention provide LED packagesthat have smaller footprints compared to conventional LED packages withhemispheric encapsulants, while still emitting with the same or similarefficiency. These can include footprint sizes and areas mentioned above,among others. The LED package 550 according to the present invention canalso provide for efficient light emission for devices with a smallerratio of LED chip area to LED package footprint. This allows for theedge of the LED chips in the LED arrays to be closer to the edge of theencapsulant to provide greater LED emission area per combined LEDpackage footprint for the array. Like above, in some embodiments, theratio of LED chip array area to LED package footprint can be less thansix, while in other embodiments it can be less than five. In still otherembodiments it can be less than four, with some embodiments having aratio of approximately 3.5. In still other embodiments, the ratio can beless than three. The embodiments according to the present invention canalso have different combinations of footprint ratio dimensions to heightdimensions as discussed above. In packages having non-square submounts,the height of the encapsulant can be greater than the largest submountfootprint dimension, and for rectangular submounts the height can begreater than the length and/or width of the submount. Other embodimentsaccording to the present invention can have different encapsulantheights as discussed above and in some embodiments, the emission patternof the packages can change with the height of the encapsulant, with someembodiments having a wider emission pattern for higher encapsulants.

Like the embodiments above, the submount area for LED packages havingmultiple LEDs can be as low as the LED area of all the LED chipscombined plus 2 times the conversion material layer thickness at theedge of the submount. Different ratios can also be achieved withsubmounts having different shapes. In other embodiments having multipleLED chips, the ratio of LED chip area to LED package footprint in theseembodiments can be as low as approximate 1.046. In still otherembodiments, the ratio can be as high as 20 or more. In differentembodiments, the ratio can fall in the range of 1 to 20, 1 to 15, 1 to10, 1 to 5, 1 to 3, or 1 to 2.

Having greater LED area for package footprint can allow for higherpacking density. The LED packages can be used in place of conventionalLED packages, and for the same amount of area can provide greater LEDemission area. In many applications, this allows for driving the samearea of LED packages with a lower drive signal to achieve the sameemission intensity. This can result in greater emission efficiency. Inother embodiments, the same drive current can be used, and the LEDpackages according to the present invention can be used to generatehigher emission intensity. The embodiments according to the presentinvention provide the flexibility of providing LED package emission withhigh luminous flux, or with lower luminous flux at greater efficiency.

The present invention provides for various combinations of LED shapesand encapsulant surface arrangements. The blue emitting LED chips 552 acan comprise angled surfaces to enhance light emission, that are nowprovided in combination with an encapsulant having vertical and/orhorizontal planar surfaces. The red LED chip 552 b is provided withhorizontal and vertical surfaces used in combination with horizontal andplanar surfaces of the encapsulant. As described in more detail below,these are only a few of the surface combinations that are provided indifferent embodiments according to the present invention.

The encapsulant 558 is described above as being included on theconversion material layer 556, and over the LEDs 552 and submount 554.The conversion material layer 556 is also described as comprising aconversion material in a binder, with the encapsulant provided over theconversion material layer. It is understood that in other embodiments,the conversion material can be included in the encapsulant, with someembodiments having a conversion material that occupies less than all ofthe encapsulant. Some embodiments can be provided with a conversionmaterial that occupies less than 80% of the encapsulant. In still otherembodiments the conversion material layer can occupy less than 50% ofthe encapsulant, while in other embodiments it can occupy less than 25%of the encapsulant. In still other embodiments the conversion materialcan occupy less than 10% of the encapsulant.

In different embodiments, the conversion material can occupy encapsulantregions of different shapes and sizes and in some embodiments theconversion material can comprise a layer in different locations so thatat least some light from the package LEDs passes through the conversionmaterial. The conversion material layer can be arranged in manydifferent ways and can have different shapes, thicknesses andconcentrations. In different embodiments, the conversion material canoccupy different areas of the encapsulant. That is, some areas of theencapsulant can have a conversion material while in others the remainingarea will have none. In some encapsulant embodiments the conversionmaterial can be in a lower portion of the encapsulant and the upperportion of the encapsulant may not having a conversion material. Is someembodiments, the conversion material can be in the lower three fourthsof the encapsulant, while in other embodiments it can be in the lowerhalf of the encapsulant. In still other embodiments it can be in thelower one fourth of the encapsulant, while other embodiments it can bein lower tenth of the encapsulant.

Referring again to FIGS. 68 and 70, the conversion material layer 556can be included in the encapsulant 558 and can occupy the lower portionof the encapsulant 558. In the embodiment shown, the conversion materiallayer can comprise a conversion material layer within the encapsulant atthe bottom of the encapsulant 558. Like the conversion material layerdescribed above, the conversion materials included in the encapsulantcan comprise many different types of conversion materials. In someembodiments the different materials can be mixed, while in otherembodiments that conversion material can be divided into different areashaving different conversion materials.

The different LED package embodiments can operate from different drivesignals as discussed above, with some operating from signals as low as50 mWatts to several tens of Watts. The LED packages can also operate atdifferent color temperatures as discussed above. The LED packagesaccording to the present invention can also exhibit other performancecharacteristics. FIG. 73 shows a graph 630 showing the luminous flux fordifferent input currents, and

FIG. 74 is a graph 640 showing the efficacy for different embodimentsaccording to the present invention in response to different inputcurrents.

As mentioned above, the LED packages according to the present inventioncan be arranged with different numbers of LEDs arranged in differentways. FIGS. 75 through 78 show another embodiment of an LED package 650according to the present invention comprising a submount 554, conversionmaterial layer 556, encapsulant 558, solder pads 560 a-d and conductivevias 562 a-d. This embodiment comprises four blue emitting LEDs 652 a,and two red emitting LEDs 652 b mounted to die attach pads on thesubmount 554. The LEDs 652 a, 652 b can comprise many differentcommercially available LEDs mentioned above, with the blue emitting LEDs652 a preferably comprising LEDs from the DA family commerciallyavailable from Cree, Inc. In this embodiment, each of the blue emittingLEDs 652 a can be arranged at respective one of the corners of thesubmount 554, with the red emitting LED 652 b mounted between the blueemitting LEDs 652 along opposing edges of the submount 554. As with theembodiment above, a conversion material layer 556 is included on theblue LEDs 652 a, and the exposed surfaces of the submount 554 and attachpads around the blue LEDs. The red LEDs are not covered by theconversion material layer. This conversion material layer is arrangedsimilar to the same conversion material layer described above, andprovides the recycling of TIR light as described above. It is noted thatin LED package 650, as well as the other embodiments described herein,the red LED chips may not be covered by the conversion material layer.

The die attach pads (not shown) can be in many different locations, canbe made of the same materials as described above and can be depositedusing the same methods. As with the embodiment above, during operationelectrical signals can be applied to the solder pads 560 a-d that aretransmitted to the attach pads through the vias 562 a-d. The signal isthen transmitted to the LEDs 652 a, 652 b causing them to emit light.The LED package operates in much the same way as LED package 550, andcan have the same sizes and ratios described above, In the embodimentshown, the LEDs 652 a, 652 b are arranged the perimeter, but in otherembodiments some of the LEDs can be arranged off the perimeter with somecloser to the center of the submount.

The LED packages described herein can have LEDs that are interconnectedin many serial and parallel combinations. In the embodiments shown theblue LEDs can be coupled in series, or parallel, or combinationsthereof, and for embodiments having multiple red LEDs they can besimilarly interconnected. The blue and red LEDs can be separatelycontrolled, with each of the LED types being controlled by a respectiveelectrical signal applied to two of the four solder pads 560 on thebackside of the submount 554. That is, different electrical signals canbe applied to the solder pads to vary the emission intensity of the blueand red LEDs, to vary the overall emission color of the LED packagesaccording to the present invention. This can allow for changing the LEDpackage emission under different conditions. For example, the human eyemay be more sensitive to blue light at nighttime, while it may be moresensitive to green light during the daytime. Independent control allowsfor the emission of the LED packages to be tuned during the course ofthe day to meet the varying sensitivity of the human eye. This is onlyone example of the many different circumstances that may exist that callfor varying the emission of the LED packages.

FIGS. 79 through 82 show another embodiment of an LED package 660according to the present invention comprising a submount 554, conversionmaterial layer 556, encapsulant 558, solder pads 560 a-d and conductivevias 562 a-d. This embodiment comprises three LEDs and includes two blueemitting LEDs 662 a, and one red emitting LED 662 b with each of theLEDs mounted to attach pads. The LEDs can be mounted in many differentlocations with this embodiment having the blue emitting LEDs 662 amounted at opposing corners of the submount 554, and the red LED 662 bmounted near the center of the submount 554 between the blue emittingLEDs 662 a. As with the embodiments above, the conversion material layercan cover the blue LEDs 662 a and the top surface of the submount 554,but not the red LED 662 b. The LED package 660 operates in much the sameway as the LED packages described above, and can have the same size anddimension ratios.

It is understood that different LED package embodiments according to thepresent invention can have many different shapes with some having feweror more side surfaces. FIGS. 83 through 86 show an LED package 680having a rectangular shape, with a submount and encapsulant footprintwith two sides that are longer than the remaining two. The LED packagecan have many different dimensions, with the LED package 680 beingotherwise similar to the embodiments above, and can comprise a submount554, conversion material layer 556, encapsulant 558. In this embodiment,the bottom surface of the submount 554 comprises six solder pads 682 a-fand conductive vias 684 a-f. This embodiment further comprises four blueemitting LEDs 686 a, and two red emitting LED 686 b mounted to dieattach pads on the submount 554. In this embodiment, each of the blueemitting LEDs 686 a arranged at a respective one of the corners of thesubmount 554, with the red LEDs 686 b being mounted such that they arediagonal across between two of the blue emitting LEDs 686 a. This isonly one of the many different ways that the LEDs 686 a, 686 b can bemounted in different packages according to the present invention.

The solder pads are arranged in much the same way as the embodimentsabove, with electric signals applied to the solder pads 682 a-f beingconducted to the LEDs 686 a, 686 b through the vias 684 a-f and theattach pads. In this embodiment, however, three different electricalsignals can be applied to provide additional control over the emissionof the LEDs 686 a, 686 b. In some embodiments, subsets of the blue orred LEDs 686 a, 686 b can be controlled by different signals toseparately vary the emission of the subsets.

As mentioned above, in multiple LED package embodiments it may beadvantageous to place the LEDs as close as possible to the edge of thesubmount, such as the blue emitting LEDs. This may be particularly truewhen using the LED packages in a linear arrangement. For example, forthe three LED embodiments described herein, it may be advantageous toplace the blue LEDs at opposing corners on the submount, while LEDpackages having four LEDs can have an LED at each of the corners of thesubmount.

As mentioned above, the encapsulant can be formed in the LED packagesaccording to the present invention using different methods, with someembodiments using different molding processes. One such molding processis referred to as compression molding wherein a mold is provided havinga plurality of cavities each of which has an inverted shape of the lensas described above and shown in FIG. 42. The same molding process can beused for LED packages having multiple LEDs. Referring again to theembodiments described above, and by way of example the LED package 550shown in FIGS. 65 to 69, a small encapsulant connection section 569 canbe included at the base of the encapsulant 58. This is a byproduct ofthe molding process as discussed above.

It is understood that other fabrication processes can be used with onesuch process comprising covering of a submount panel and its LEDs with alayer of encapsulant material and that the individual LED packages canthen be separated by different methods such as dicing or cutting throughthe encapsulant and submount. The resulting packages can haveencapsulant side surfaces that are approximately vertical and alignedwith the edges of the submount. FIGS. 87 through 90 show anotherembodiment of an LED package 720 according to the present inventioncomprising a LEDs 552. submount 554, conversion material layer 556,solder pads 560 a-d and conductive vias 562 a-d. In this embodiment, thesidewalls of the encapsulant do not have the connection section, and areessentially aligned with the outer edge of the submount 554 and arevertical. This arrangement can be the result of coating and dicingfabrication process, with the side surfaces being smooth to promote TIRwithin the encapsulant. In still other embodiments, the encapsulants canbe separately molded and then attached to the submount over phosphorconversion material layer. It is understood that the surfaces of theencapsulants can be smoothed or further shaped using different methods,such a cutting, grinding, sanding or etching.

Like the embodiments above, the surfaces of the encapsulant can besmooth enough such that the LED is clearly visible through theencapsulant, and there is little or no roughness on the surface of theencapsulant to obscure or redirect the light rays passing through theencapsulant. In some embodiments where there is some texturing,roughness or imperfections the surface features should have sizes havinga root mean square (RMS) close to or greater than the wavelength oflight encountering the surface.

FIG. 91 shows another embodiment of a LED package 750 according to thepresent invention having six LEDs 752, a submount 754, and anencapsulant 756, and vias 757 a-d. FIG. 92 shows the die attach pads 758for the package 750, and FIG. 93 shows the solder pads 760 a-d for thepackage 750. The encapsulant 756 can be made of the same materials andarranged in the same ways as the encapsulants described above. Referringto FIG. 91, the LEDs 752 can comprise four blue emitting LEDs 752 a, andtwo red emitting LEDs 752 b, which can be commercially available LEDssuch as those described above. Two of the blue emitting LEDs 752 a canbe arranged along one edge of the submount 754, and the other two alongthe opposing submount edge. The two red emitting LEDs 752 b are arrangedbetween the two sets of blue emitting LEDs 752 a. The LED package cancomprise a conversion material layer as described above that covers theblue LEDs 752 a, and the exposed surfaces of the submount 754 and theattach pads 758, but not the red LEDs 752 b. The conversion material isnot shown in this embodiment to allow for ease of description of the dieattach pads 758.

The vias 757 a-d are electrically conductive paths between the attachpads 758 and the solder pads 760, through the submount 754. Referring toFIGS. 91, 92 and 93, a first set of attach pads 758 a are arranged tointerconnect the blue LEDs 752 a in series and to apply a signal fromthird and fourth solder pads 760 c, 760 d to the blue LEDs 752 a, withthe signal passing though third and fourth vias 757 c, 757 d to theattach pads 758 b. Each of the blue LEDs 752 a spans a space betweenadjacent portions of the attach pads 758 a with the electrical signalpassing through each of the blue LEDs 752 a. A second set of attach pads758 b is arranged to apply an electrical signal from first and secondsolder pads 760 a, 760 b to the red LEDs 752 b. The signal can beconducted through the first and second vias 757 a, 757 b to the red LED752 b that are serially interconnected with the attach pads 758 b andwire bonds 762. It is noted that in the embodiment shown, the red LEDs752 b can have insulating substrates, such that an electrical signalapplied to the red LEDs 752 b does not pass into the portion of theattach pads 758 b below the LEDs, and a electrical signal on theseattach pads 758 b does not pass into the red LED chips 752 b, exceptthrough the wire bonds 762.

The LED package 750 can also comprise a polarity indicator as describedabove, with different embodiments having the indicator in differentlocations. Referring now to FIG. 93, polarity indicators can be includedin the form of notches 764 a, 764 b in the corners of the second andthird solder pads 760 b, 760 c. These notches 764 a, 764 b that can bedetected with up-looking cameras on automated pick-and-place equipmentduring manufacturing. In the embodiment shown, the notches 764 a, 764 bcan be on the inner corners of the pads so that they are near the centerof the submount 754. Referring now to FIG. 16 above, showing aconventional carrier tape 80, one or both of the notches 764 a, 764 b inthe area of the submount 554 near the center can be visible through hole82 in the carrier tape 80. This allows for the notch (and thecorresponding LED package polarity) to be visible and verified carriertape hole 82 without removing the LED package from the carrier tape 80.

The notches 764 a, 764 b can have many different shapes as describedabove and can be included in many different locations. The LED package750 can also comprise a polarity indicator on the top of the submountthat can comprise many of the different shapes described above. In theembodiment shown, the top polarity indicator an comprise a plus sign 766is the die attach pads 758.

FIG. 94 shows still another embodiment of an LED package 850 accordingto the present invention that is similar to the LED package 750described above. This embodiment comprises nine LEDs 852, a submount854, an encapsulant 856, and vias 857 a-d. FIG. 95 shows the die attachpads 858 for this embodiment, with the solder pads being the similar toone or more of the embodiments described above. The LEDs 852 shown inFIG. 94 can comprise six blue emitting LEDs 852 a, and three redemitting LEDs 852 b. Three of the blue LEDs 852 a are along one edge ofthe submount 854, with the remaining three along the opposite edge. Thethree red LEDs 852 b are arranged between the two sets of blue LEDs 852a. Referring now to FIGS. 94 and 95 in combination, like above the blueLEDs are mounted to the mounted to the first set of die attach pads 858a and are serially interconnected. A signal applied to solder padsconducts to the blue LEDs 852 a causing them to emit light. The red LEDsare also connected in serial between the second set of die attach pads858 b and through wire bonds 862. A signal applied to the solder pads isconducted to the attach pads 858 b and is conducted through the red LEDs852 b along wire bonds 862. It is noted that a portion of the first dieattach pads 858 a passes under one of the red LEDs 852 b, but in thisembodiment the bottom of the red LEDs 852 b is electrically insulatingso that electrical signals will not pass between the red LED 852 b andthe portion of the attach pads 858 a.

Other embodiments can be arranged to hold even more LEDs. FIG. 96 showsstill another embodiment of a submount 910 having a die attach pattern912 that can be used to connect up to sixteen LEDs (not shown) inseries, with each of the LEDs being mounted across the space betweenadjacent elements of the pattern. The pattern can be used for mountingdifferent LEDs emitting different colors of light. In embodimentsutilizing 3 volt LEDs, a 48 volt drive signal can be used. Like above,this driver signal can be higher or lower, depending on the voltage andnumber of LEDs mounted to the submount. FIG. 97 shows still anotherembodiment of a submount 920 comprising a first U-shaped attach pad 922a, interdigitated with a second W-shaped attach pad 922 b such that upto 16 LEDs can be connected in parallel. As with the embodiment above,each of the LEDs can be mounted across the space between the first andsecond attach pads 922 a, 922 b. Using 3 volt devices, this package canutilize a 3 volt drive signal, with this signal being higher or lower asdiscussed above.

The embodiments above have been described with reference to certainembodiments arranged in different ways, but it is understood thatdifferent features described above can be utilized in different packagesarranged in different ways. For example, the features above can be usedin packages similar to those commercially available from Cree, Inc.,including but not limited to the XLampCX, XLampM and XLampX family ofLED packages.

The LED packages described above can be used in many different lightingapplications or luminaires using a single LED package or multiple LEDpackages. In lighting applications using multiple conventional LEDpackages, a mixing chamber can be needed to mix the light from the LEDpackages, particularly in those embodiments utilizing LED packagesemitting different colors of light that are then mixed to provide thedesired color of light. In some of these conventional lightingapplications, the minimum depth of the mixing chamber can beapproximately the same as the distance between LED packages emitting thesame color of light. The use of mixing chambers adds to both the costand complexity of conventional luminaires.

In luminaires using LED packages according to the present invention,much of the mixing takes place within the LED packages. As a result, forsome of these applications the mixing chamber can be eliminated, but inother embodiments, the mixing chamber may be included for aestheticreasons and to assist in mixing the colors. In these arrangements, thedepth of the mixing chamber can be greatly reduced. FIG. 98 shows oneembodiment of a luminaire mixing chamber 940 having LED packages 942arranged according to the present invention. The mixing chamber 940 canhave a height 944 and the LED packages can have a height 946, and insome embodiments the mixing chamber height 944 can be less than fourtimes the height of the LED packages 942. In other embodiments it can beless than three times the height of the LED packages. In otherembodiments it can be less than 1.5 times the height of the LEDpackages. Providing luminaires without mixing chambers or with mixingchambers having a reduced depth can result in lower cost, less complex,thinner and/or smaller luminaires.

As discussed above, the LED packages according to the present inventioncan comprise one or more LEDs that can have many different shapes andsizes, and can have many different features. FIGS. 99 and 100 showanother embodiment of an LED package 1000 according to the presentinvention comprising LEDs 1002, mounted on a submount 1004, with aconversion material layer 1006 and an encapsulant 1008. These elementsare similar to corresponding elements described above and can comprisethe same materials arranged as described above. In this embodiment,however, the LEDs 1002 can comprise first LEDs 1002 a and a differenttype of second LEDs 1002 b, and in some embodiments the first LEDs 1002a can emit blue light and the second LEDs 1002 b can emit red light asdescribed above. In this embodiment, however, the first LEDs 1002 a havea textured top surface 1010 that can be arranged to enhance lightextraction from the LEDs 1002 a. Each of LEDs 1002 a can also comprise acurrent spreading structure 1012 to spread current into the top surfaceof the LED. In some embodiments, wire bonds (not shown) can be includedfor conducting an electrical signal from the die attach pads orconductive traces on the submount, to the current spreading structure1012.

Many different LEDs can be used for the first LEDs 1002 a, with someembodiments utilizing commercially available LEDS such as those in theEZ family of LEDs from Cree, Inc., mentioned above. These LEDs 1002 aprovide a textured top surface that is generally parallel to the topsurface of the encapsulant 1008, and side surfaces that are generallyparallel to the side surface of the encapsulant 1008, although in otherembodiments these surfaces can be oblique to their correspondingsurfaces. It is understood that other surfaces of the LEDs 1002 a can betextured and that for all surfaces different features can be includedthat enhance light extraction. The LEDs 1002 a can be included in manydifferent LED packages arranged in different ways.

It is understood that the LED package 1000, as well as all other LEDpackage embodiments described herein, can have many different elementsarranged in different ways. FIGS. 101 and 102 show another embodiment ofan LED package 1020 that is similar to the LED package 1000, but has anencapsulant 1022 with planar side surfaces. Each of the first LEDs 1024a has a textured top surface 1026 as well as top and side surfaces thatare generally parallel to the top and side surfaces of the encapsulant1022.

FIGS. 103 and 104 show another embodiment of an LED package 1040according to the present invention comprising LEDs 1042 mounted on asubmount 1044, with a conversion material layer 1046 and an encapsulant1048. In this embodiment, the LEDs comprise first LEDs 1042 a and secondLEDs 1042 b that can emit different colors of light. In this embodiment,the first LEDs 1042 a have side surfaces that are at least partiallyangled such that the at least part of the side surfaces are oblique tothe side surface of the encapsulant. In this embodiment the LED sidesurfaces are angled such that the lower portion of the LEDs 1042 a issmaller than the upper portion. This results in the distance from theside surface of the encapsulant 1048 increasing moving down the sidesurface of the LEDs 1042 a. Many different LEDs can be used for the LEDs1042 a, such as those commercially available from Cree, Inc., under itsUltra Thin family of LED chips. These LEDs 1042 a can be used in manydifferent LED packages shapes and arranged as described above. FIGS. 105and 106 show an LED package 1060 that is similar to the LED package1040, but has an encapsulant 1062 with planar surfaces. The LED package1060 further comprises first LEDs 1062 a each of which has angled sidesurfaces that are oblique to the side surfaces of the encapsulant 1062.

The LED packages 1000, 1020, 1040 and 1060 have been shown and describedwith LEDs having generally square footprints. It is understood thatdifferent LED packages can have LEDs with different footprint shapes.FIGS. 107 and 108 show another embodiment of an LED package 1080according to the present invention comprising LEDs 1082, mounted on asubmount 1084, with a conversion material layer 1086 and an encapsulant1088. In this embodiment, the LEDs comprise first LEDs 1082 a havingangled side surfaces oblique to the side surfaces of the encapsulant1088. Instead of a square footprint, the first LEDs 1082 a have arectangular footprint. Many different LEDs can be used with arectangular footprint, such as those commercially available from Cree,Inc., under its TR family of LEDs mentioned above. These LEDs can alsobe used in different types of LED packages, with FIGS. 109 and 110showing another embodiment of an LED package 1100 according to thepresent invention that is similar to the LED package 1080, but has anencapsulant 1102 with planar side surfaces.

FIGS. 111 and 112 show another embodiment of an LED package 1120according to the present invention also comprising LEDs 1122, mounted ona submount 1124, with conversion material layer 1126 and an encapsulant1128. In this embodiment, the first LEDs 1122 a have a generally squarefootprint and side and top surfaces that are generally parallel to theside and top surface of the encapsulant 1128. Many different types ofLEDs can be used with this footprint and shape, such as those havingsubstrates made out of insulating materials such sapphire. The LEDs 1122a can also be comprise other features, such as wire bonds or lightextraction features (not shown). These LEDs can also be used indifferent types of LED packages, with FIGS. 113 and 114 showing anotherembodiment of an LED package 1140 according to the present inventionthat is similar to the LED package 1120, but has an encapsulant 1142with planar side surfaces. The side and top surfaces of the LEDs 1122are generally parallel to the side and top surfaces of the encapsulant1142.

It is understood that different LED package embodiments can havedifferent combinations of the LEDs described above, with some havingdifferent combination of LEDs with parallel surfaces, oblique surfacesand/or textured surfaces. FIGS. 115 and 116 show one embodiment of andLED package 1160 according to the present invention having comprisingLEDs 1162, mounted on a submount 1164, with a conversion material layer1166 and an encapsulant 1168. In this embodiment the LEDs 1162 comprisea first LED 1162 a having a textured top surface, a second LED 1162 bhaving a square footprint with oblique side surfaces, a third LED 1162 cwith a rectangular footprint and oblique side surfaces, and a fourth LED1162 d with a square footprint and top and side surfaces generallyparallel to those of the encapsulant 1168. Each of the LEDs 1162 canhave many different features such as wire bonds, current spreadingstructures and light, extraction features (not shown). This is only oneof the many different combinations that can be used according to thepresent invention. These different combinations can also be used in anyof the different types and shapes of LED packages described above. FIGS.117 and 118 show an LED package 1180 having the same combination offirst, second, third and fourth LEDs 1162 a, 1162 b, 1163 c, 1162 d, butwith an encapsulant 1182 having planar surfaces as described above.

It is understood that the different LEDs described above are only a fewof the many different LEDs that can be used in LED packages according tothe present invention. It is also understood that LED packages accordingto the present invention can be provided with a single LED with theshapes and features described above.

As mentioned above, the LED packages according to the present inventioncan have encapsulants with many different shapes and sizes, and can havedifferent numbers of planar surfaces arranged in different ways. Instill other embodiments, the LED packages can be arranged with hybridencapsulants having both planar and curved surfaces arranged indifferent ways to achieve the desired package emission profile, emissionefficiency and variation in color temperature. In some embodiments, theuse of a hybrid encapsulant can result in more narrow emission patternthat is desirable for some applications.

FIGS. 119 to 125 show another embodiment of an LED package 1200according to the present invention having a generally square footprint.Similar to some of the embodiments above, the LED package 1200 cancomprise an LED 1202 mounted on a submount 1204. The LED package 1200also comprises first and second bottom contact/solder pads 1206 a, 1206b on the bottom of the submount 1204. First and second die attach pads1208 a, 1208 b can be included on the top surface of the submount 1204and first and second conductive vias 1210 a, 1210 b are included thatpass through the submount 1204 between the die attach pads 1208 a, 1208b and the solder pads 1206 a, 1206 b. The LED 1202 and submount 1204 cancomprise any of the devices and materials described above, and can bearranged in many different ways including those described above. Inparticular, the LED 1202 can have textured surfaces and/or obliquesurfaces, and can comprise a sapphire substrate. The pads and vias canbe made of the same materials, can be arranged in the same way, and canbe fabricated in much the same way as those described above.

Some embodiments of the LED package can further comprises a conversionmaterial layer 1212 (shown in FIGS. 122-125) covering the LED 1202, andin some embodiments the conversion material layer 1212 can also coverthe exposed surfaces of the die attach pads 1208 a, 1208 b, and exposedportions of the top surface of the submount 1204. An encapsulant 1214 isincluded over the LED 1202, the attach pads 1208 a, 1208 b, and thesubmount 1204. The conversion material layer 1212 can comprise any ofthe materials described above and can be arranged in the different waysdescribed above. The encapsulant 1214 can also comprise any of thematerials described above.

In LED package 1200, the encapsulant 1214 does not comprise only planarsurfaces, but comprises a combination of planar and curved surfaces. Theembodiment shown comprises four side planar surfaces 1216 a-d and onecurved surface 1218, with the side planar surfaces being in alignmentwith the edges of the submount 1204 and the remainder of the outersurface of the encapsulant 1214 comprising the curved surface 1218.

As discussed above, encapsulants with planar surfaces can result in LEDpackage emission profiles that are broader and can exceed 120° FWHM.These types of emission profiles are desirable for certain applicationssuch as lighting fixtures with no secondary optics. In otherapplications different package emission profiles may be desirable, suchas those needing improved far field mixing or those applicationsutilizing secondary optics. The encapsulants according to the presentinvention can comprise different curved and planar surfaces that canprovide the desired package emission profile.

The encapsulants according to the present invention can have manydifferent dimensions of planar and curved surfaces. LED package 1200 canhave an encapsulant 1214 with a curved surface having a radius ofcurvature that is greater than half the distance along the edge of thesubmount 1204. Stated differently, the radius of curvature can begreater that either half the length or width of submount 1204. Forsubmounts having a square footprint as shown in FIGS. 119 to 125, theradius of curvature can greater that both the length and width of thesubmount. With the encapsulant having this radius of curvature inrelation to the submount dimensions and utilizing a full hemisphericencapsulant, a portion of the encapsulant would overhang the edge of thesubmount 1204. However, in the embodiments shown, the edge of theencapsulant 1214 is truncated at the edge of the submount 1204 to removeany overhanging portions and thereby form planar surfaces 1216 a-d. Inthe embodiment shown, the planar surfaces 1216 a-c are each generallyvertical and each comprise curved edge formed from its intersection withthe curved surface 1218. In some embodiments the planar surfaces cantake a substantially semi-circular shape, and in other embodiments thedifferent planar surfaces can have different shapes and sizes. It isunderstood that in other embodiments, the encapsulant may not havetruncated sections such that the encapsulant overhangs the edge of thesubmount.

This combination of planar and curved surfaces allows for the LEDpackage 1200 to maintain its relatively small footprint, while alsoutilizing a encapsulant with a larger radius of curvature. In someembodiments, less light experiences TIR at the curved surface, therebyreducing the amount of light recycling compared to LED packages withcubic encapsulants. Some light may experience TIR at the planarsurfaces, but there can be an overall reduction in TIR that cancontribute to the LED package emitting more of a focused or narrowemission profile.

The LED package 1200 can have different ratios for the radius ofcurvature to the half submount length/width, with some embodimentshaving a ratio larger than 2. That is, the radius of curvature for thecurved surfaces is approximately 2 times that of the submount half(length or width) distance. In other embodiments this ratio can be inthe range of 1.5 to 2, while in still other embodiments this ratio canbe in the range of 1.0 to 2.0. In one embodiment where the submount hasa square footprint measuring 1.6 mm by 1.6 mm, the curved surface 1218can have a radius of curvature in the range of 0.81 mm to 1.2 mm. Inother embodiments, the radius of curvature can be 0.81 mm to 1.0 mm,while other embodiments can have a radius of curvature of approximate0.93 mm. These are only some of the many ratios for the radius ofcurvature to half the submount length/width that can be used inembodiments according to the present invention. In addition, the sameratios of other features as described in the embodiments above areequally applicable to LED package 1200, including chip to submount area,submount area to chip height, submount to encapsulant height, etc. TheLED package can also have a footprint of the same size as described inthe embodiments above, with some embodiments being 1.6 mm square.

The overall LED package height can be approximately the same as, orslightly less than, the length of the side of the submount. In someembodiments having a 1.6 mm square submount, the LED package can have anoverall height of approximately 1.5 mm. It is understood that in otherembodiment the overall height of the LED package can be larger than theside length of the submount. In some embodiments, the lens height can90% or less of the overall height of the LED package. In otherembodiments it can be 70% or less of the overall height, and in othersit can be less than 60% of the overall height. In some embodimentshaving a 1.6 mm square submount, the lens can be 60% or less of theoverall LED package height.

As the radius of curvature increases in the same sized devices with thesame encapsulant height, the area of the planar surfaces can increase.FIG. 126 shows a series of different LED packages 1250 according to thepresent invention, each having an encapsulant 1252 with the same orsimilar height, and a different radius of curvature. As the radius ofcurvature increases, the area of each of the planar surfaces 1254increases. For a package having an encapsulant with a 0.886 mm radius ofcurvature, the planar surfaces are relatively small. In comparison, at aradius of curvature with 1.186 mm the planar surfaces are relativelylarge such that the encapsulant approaches a shape having a lower cubicsection and an upper curved section.

For packages similar to LED packages 1200 with encapsulant 1214, thecombination of planar surfaces 1216 a-c and curved surface 1218 canresult in a more narrow package emission profile compared to packageswith cubic encapsulants such as those described above. Some of theseembodiments having a more narrow emission profile of less than 120°FWHM. Other embodiments can provide an emission profile of less than115° FWHM, while others can provide an emission profile of less than110° FWHM. Some embodiments provide an emission profile of approximately110° FWHM. The encapsulant can also provide the desired variation in CCTover a range of viewing angles, with some embodiments providing anemission profile with variations in color temperature of less than −300to +300 Kelvin at viewing angles of approximately −100 to +100 degrees.Other embodiments can provide an emission profile with variations incolor temperature of less than −400 to +400 Kelvin at the same viewingangles. Other embodiments can provide an emission profile of less than−200 to +200 Kelvin and the same viewing angles of approximately, whilesome embodiments provide an emission profile with variations ofapproximately 200K at these different viewing angles.

FIGS. 127 and 128 show the emission profiles two of the LED packagesshown in FIG. 126. FIG. 127 is a graph 1270 that shows the emissionintensity versus viewing angle plot 1272 for the package having anencapsulant with a 0.936 mm radius of curvature, and plot 1274 for apackage having an encapsulant with a 1.186 mm radius of curvature. Theviewing angle for the plot 1274 (here, FWHM less than 100°) is narrowerthan the plot 1272, showing that the more truncated dome can have anarrower emission profile. However, the emission efficiency of thepackage can decrease with encapsulants having larger radius ofcurvature. Accordingly, the type of encapsulant used can be determinedbased not only on the desired emission profile but also the desiredpackage emission efficiency.

FIG. 128 is a graph 1280 having a plot 1282 that shows the colortemperature variation at different viewing angles for the LED packagehaving an encapsulant with a 0.93 mm radius of curvature, and a plot1284 with the color temperature variation at different viewing anglesfor the LED package having an encapsulant with a 1.186 mm radius ofcurvature. The plots 1282, 1284 show that there are minimal differencesin color temperature variations for the two packages, with both having avariations in color temperature of approximately 200 Kelvin. Thepackages represented in FIG. 128 both have a correlated colortemperature of less than 4000K. Results may vary for devices havingcorrelated color temperatures greater than 4000K.

Referring again to FIGS. 119-125, and in particular FIG. 121, the LEDpackage 1200 can comprise one or more a polarity indicators, with theLED package 1200 having a notch polarity indicator 1220 in one of thesolder pads 1206 a, 1206 b. Like the embodiments above, polarityindication 1220 can be the V-shaped and can be formed along the inneredge of the solder pad 1206 a. This notch 1220 can be detected withup-looking cameras on automated pick-and-place equipment duringmanufacturing, and can be visible through carrier tape as describedabove. Like above, the polarity indicator 1220 can have many differentshapes beyond V-shaped, such as U-shaped, I-shaped, W-shaped, squareshaped, rectangular shaped, star shaped, plus shaped, minus shaped, etc.The notch can also be included in many different locations on the solderpads 1206 a, 1206 b, as further described above. In the embodimentshown, the polarity indicator identifies the cathode (−) of the LEDpackage 1200, but in other embodiments it can signify the anode (+).

Referring now to FIG. 120, the LED package 1200 can also comprise anupper polarity indicator 1222 similar to those described above. Thesecond attach pad 1208 b can have a plus (+) indicator to show polaritywhen viewing the LED package 50 from the top. These indicators can takemany different shapes and sizes such as those described above, and insome embodiments can comprise notches or holes as described above. Inthe upper polarity indicator signifies the anode for the LED package1200, but it is understood that in other embodiments it can comprise thecathode.

The LED package 1200 can also comprise a ESD protection chip 1224arranged on the submount to protect the LED package from damage due toelectrostatic discharge. The ESD chip 1224 can be arranged in manydifferent locations, with the embodiment shown being arranged on thesurface of the submount 1204, adjacent the LED 1202.

As mentioned above, the packages according to the present invention canhave conversion or scattering materials that are fully or partiallymixed in the encapsulant material. In some of these embodiments, theencapsulants can appear fully or partially opaque. As described above,the encapsulant can be included on the conversion material layer, andover the LEDs and submount. The conversion material layer is alsodescribed as comprising a conversion material in a binder, with theencapsulant provided over the conversion material layer. It isunderstood that in other embodiments, the conversion material can beincluded in the encapsulant, with some embodiments having a conversionmaterial that occupies less than all of the encapsulant. Someembodiments can be provided with a conversion material that occupiesless than 80% of the encapsulant, 50% of the encapsulant, or 25% of theencapsulant. In still other embodiments the conversion material canoccupy less than 10% of the encapsulant.

Like the embodiments above, the conversion material can occupyencapsulant regions of different shapes and sizes and can be indifferent locations so that at least some light from the package LEDspasses through the conversion material. The conversion material layercan be arranged in many different ways and can have different shapes,thicknesses and concentrations and the conversion material can occupydifferent areas of the encapsulant. In some encapsulant embodiments theconversion material can be in a lower portion of the encapsulant and theupper portion of the encapsulant may not having a conversion material.In some embodiments, the conversion material can be in the lower threefourths of the encapsulant, the lower half of the encapsulant, or thelower one fourth of the encapsulant. In other embodiments it can be inlower tenth of the encapsulant. The encapsulant can also comprisedifferent scattering materials or elements in or on the encapsulant tohelp scatter light as it through the encapsulant.

FIGS. 129-132 show another embodiment of an LED package 1300 accordingto the present invention that is similar to the LED package 1200described above and shown in FIGS. 119-125. In this embodiment, however,the encapsulant 1302 is fully or partially opaque so that the LED (notshown) and the top surface of the submount 1306 under the encapsulant isnot clearly visible. The encapsulant 1302 can be made fully or partiallyopaque by conversion material mixed fully or partially in theencapsulant 1302, or with a conversion material on the encapsulant 1302.In still other embodiments, the encapsulant 1302 can be made fully orpartially opaque by scattering particles or elements mixed in or formedon the encapsulant 1302.

Like the embodiments above, the encapsulant can be formed in the LEDpackages using different methods, with some embodiments using differentmolding processes such as the compression molding processes using a moldwith a plurality of cavities. A submount panel with LEDs as describedabove can be provided that can have an area approximately the same orless than as that covered by the cavities. The mold is loaded with anencapsulant material in liquid form filling the cavities, and thesubmount panel can be moved toward the cavity with the LEDs in contactwith or embedded in the liquid encapsulant within one of the respectivecavities. The liquid can then be cured using known curing processes andthe panel can then be removed from the mold. The individual LED packagescan then be separated or singulated from the submount panel, using knowntechniques.

Similar to some of the cube encapsulant embodiments described above, theembodiments having encapsulants with curved surfaces may also have asmall encapsulant connection portion. FIGS. 133-139 show anotherembodiment of an LED package 1320 that is similar to LED package 1200described above and comprises an LED 1322 mounted to a submount 1324having first and second contact pads 1326 a, 1326 b, first and seconddie attach pads 1328 a, 1328 b, and vias 1330 a, 1330 b. The LED packagecan also have a conversion material layer 1332 and encapsulant 1334,polarity indicators 1336, 1338 and an ESD chip 1340. Like some of thecubic encapsulant embodiments described above, a small encapsulantconnection section 1342 is included at the base of the encapsulant 1334.This is a byproduct of the molding process as described above. Thecavities in the molding process may not extend to the top surface of thesubmount 1324 and the curved shape of the encapsulant may result incorner portions of the submount not covered by its corresponding cavity.This leaves the encapsulant section 1342 at the corners of the LEDpackage between adjacent ones of the LED packages. The singulationprocess cuts through the connection section 1342 and the submount 1324when separating the LED packages. The cavities of the molds can overlapso that during the singulation process the planar surfaces are formed inthe encapsulants. In still other embodiments, that planar surfaces canbe formed in a later truncation process where the overhanging section ofthe lens can be removed.

It is understood that other fabrication processes can be used with onesuch process comprising covering of a submount panel and its LEDs with alayer of encapsulant material. The encapsulant material can then beshaped using different methods to form the curved surface, such ascutting, grinding, sanding or etching. The individual LED packages canthen be separated by different methods such as dicing or cutting throughthe encapsulant and submount. In still other embodiments, theencapsulants can be separately molded and then attached to the submountover phosphor conversion material layer. It is understood that thesurfaces of the encapsulants can be smoothed or further shaped usingdifferent methods, such a cutting, grinding, sanding or etching.

Like the embodiments above, the LED packages with connection sectionscan also have conversion material or scattering particles fully orpartially dispersed in its encapsulant. FIGS. 140-143 show anotherembodiment of an LED package 1350 according to the present inventionhaving an encapsulant 1352 on a submount 1354. Like the embodimentabove, the encapsulant comprises connection sections 1356 at itscorners. In this embodiment, however, the encapsulant is fully orpartially opaque from the conversion and/or scattering materials orelements partially of fully mixed in the encapsulant 1352.

The embodiments above are described with reference to LED packages witha single LED chip, and many different types of LED chips can be usedsuch as those described above. It is also understood that the LEDpackages can comprise multiple LEDs as described above, that can beinterconnected in different serial and parallel interconnect patters.The LED packages can have different types of LEDs in the same package toachieve the desired emission profile with some having differentcombinations of LEDs with parallel surfaces, oblique surfaces and/ortextured surfaces. The LED chips can have surfaces that are fully orpartially oblique to one or more of the encapsulant planar surfaces.

It is understood that different LED packages according to the presentinvention can be arranged in many different ways beyond those describedabove. The submounts in the embodiments described above have a squarefootprint, and the encapsulant extends to the edge of the submount. Inother embodiments, the encapsulant may not extend to the edge of thesubmount, or may extend to only one or less than all of the edges. It isalso understood that different submounts can have different polygonshaped foot prints with any number sides such as triangle, pentagon,hexagon, octagon, etc., and the submounts can have shapes with differentlength and width, such as a rectangle. In other embodiments, thesubmount can have one or more curved edges and can be circular or ovalshaped, with the encapsulant having different shapes such as a bulletshape.

In the embodiments above, the planar surfaces are shown at and inalignment with the edges of the submount and orthogonal to the topsurface of the submount, such that the planar surfaces are generallyvertical. In other embodiments, the planar surfaces can be angled indifferent ways, and in other embodiments the planar surfaces can bearranged such that they are in from the edge of the submount. In stillother embodiments, there can more or fewer planar surfaces than thereare submount edges. Still in other embodiments, there can be more thanone curved section, with different ones having different radius ofcurvature.

The encapsulants can also comprise features such as texturing. Referringagain to FIG. 126, the LED packages have texturing features 1360 on theoutside surface of the encapsulant 1252. This texturing can be formed inthe encapsulant 1252 during the molding process with roughness from thecavity surface transferring to the encapsulant. This texturing mayassist in light extraction from the LED package 1250, with someembodiments having texturing features that are less than 5 μm deep.Other embodiments can have features that are less than 2 μm deep, whileothers can have features that are approximately 1 μm deep.

The packages according to the present invention can serve as the lightsource for lamps such as those described in U.S. patent application Ser.No. 13/034,501, to Le et al., entitled “High Efficiency Solid State Lampand Bulb”, and U.S. patent application Ser. No. 13/028,946, to Le etal., entitled “Solid State Lamp and Bulb”, both incorporated byreference as if set forth fully herein.

The LED packages can also be used in troffer type lamp fixtures such asthose described in U.S. patent application Ser. No. 13/368,217 toPickard et al., entitled “Multiple Panel Troffer-Style Fixture”, andU.S. patent application Ser. No. 12/873,303 to Edmond et al., entitled“Troffer-Style Fixture”, both incorporated by reference as if set forthfully herein.

The LED packages can also be used in many other lighting applicationssuch as LED displays, LED street lighting, residential LED downlighting,etc. Some LED package embodiments of the present invention areparticularly applicable to fluorescent tube replacement LED lightingwith the emission pattern of the LED packages being desirable for lineararrays such as those used in fluorescent tube replacements.

The LED packages can be arranged with many different features beyondthose described above. Some embodiments can comprise differentelectrostatic discharge (ESD) protection elements or devices. Others ofthe LED packages can be arranged with secondary optics to furtherdisperse, spread or columnate the package beam profile. In still otherembodiments, different ones of the LEDs within the package can bemounted higher than others of the LEDs to provide the desired LEDpackage emission pattern.

Although the embodiments above are described herein with reference toLED packages with conversion material layers, it is understood thatother embodiments can be provided without a conversion material layer.Some of these embodiments can comprise an encapsulant with one or moreplanar surfaces along with a blue, red or green LED chip by itself toprovide LED packages emitting blue, red or green light. Otherembodiments can also comprise multiple LED chips emitting differentcolors of light such as red, green or blue emitting LEDs, or red green,blue and white emitting LEDs. These are only some of the combinationsthat are possible in different embodiments according to the presentinvention. The LED packages can be arranged with many additionalfeatures, such as adaptors to allow for handling and mounting of theserelatively small packages.

The LED packages can be arranged with many additional features, such asadaptors or connectors to allow for handing and mounting of theserelatively small packages. The different LED package embodiments cancomprise different markings or other features to assist in alignment, orthe mounting area can have marks or features to assist in alignment andmounting of the LED packages.

As mentioned above, the LED packages according to the present inventioncan have different features to enhance light extraction, which in turncan increase the package's overall light emission efficiency. Some ofthese package embodiments can comprise a reflect layer arranged toreflect light from the package's LED chip and/or the package'sconversion material to reduce or eliminate undesired absorption of thelight. The light is instead redirected to avoid absorption and in a waythat it can contribute to the overall emission of the package. Thereflective layer can be particularly arranged to reflect light directedtoward the submount that might otherwise experience light absorption atthe submount, such as at the die attach pads or the submount material.The reflective layer redirects this light toward the package encapsulantwhere it can emit from the package.

The reflective layer can be arranged in different locations and indifferent ways in LED packages according to the present invention. Insome embodiments it is on the same surface of the submount having theLED chips. The reflective layer can at least partially surround the LEDchips, and can cover the surface of the submount. In some embodiments,this surface of the submount can comprise the exposed surfaces of thedie attach pads around the LED chips, the top surface of the submountaround the LED chips, the wirebonds, and/or the ESD chip. In otherembodiments where the conversion material layer covers the attach padsand submount, this reflect layer can be on the conversion material layerwith the conversion material between the reflective layer and thesubmount. In still other embodiments, the conversion material layer canbe on the reflective layer, with the reflective layer between theconversion material layer and the submount. In still other embodiments,the reflective layer can cover only selective portions of the submount,on selective ones of the die attach pads, wirebonds and ESD chip.

In different embodiments, the reflective layer can provide differentcoverage over this top surface. In some embodiments the reflective layercan cover 70% or more of the top surface around the LED chips, while inother embodiments it can cover 80% or more of the top surface around theLED chips. In other embodiments it can cover 90% or more of the topsurface, while in still other embodiments the reflective layer canextend from the edges of the LED chips to the edge of the submount sothat substantially all of the top surface is covered. In some of theseembodiments, the reflective layer can also cover the sidewalls of theLED chips, with this coverage occurring through wicking of thereflective layer during manufacturing. In some of these embodiments, thereflective layer can also be arranged in portions under the LED chip,while still accommodating electrical connection to the LED chip.

The reflective layers can be arranged such that when light from the LEDchips and/or the conversion material, is directed toward the submount(either directly or by TIR) the reflective layer can reflect the lightbefore it experiences absorption at the submount. The reflective layercan comprise many different materials, with some embodiments comprisinga binder material with at least one highly reflective/refractivematerial contained therein. In other embodiments, the reflective layercan be employed in combination other materials, such a metal reflectorelements, to further increase luminous efficacy.

In some embodiments, the reflective layer can generally comprise a“white paint” that can comprise a binder material that in someembodiments can be substantially transparent. The reflective layer canalso comprise a predetermined loading of at least one high index ofrefraction (IR) material dispersed, distributed, and/or suspendedtherein. The binder can be organic, inorganic, or a mixture thereof, andcan have an IR that is lower than that of the high IR material. In someembodiments, the binder can have an IR of less than about 1.6, while inother embodiments it can have an IR of about 1.5. The binder materialcan be transparent in the visible spectra and/or at least a portion ofthe UV region (e.g., from about 200 nanometers to about 850 nanometers).Preferably, the binder is at least 85% transparent in the visiblespectra and/or at least a portion of the UV region corresponding to thewavelength(s) of the LED light emitted from the package, while in otherembodiments it is at least 90% transparent. In still other embodiments,the binder is greater than or equal to at least 95% transparent.

The combination of binder and highly refractive material provides areflective layer that is generally opaque and/or translucent inappearance, in part due to the loading and/or average particle size ofthe reflective material. In some embodiments the reflective layer canappear opaque white or off-white in appearance. In other embodiments, aconversion material can be included in the reflective layer, with theconversion material giving the reflective layer a colored translucent oropaque appearance.

Suitable binder materials for the reflective layer include transparentorganic polymers. Suitable transparent organic polymers includesilicones, siloxanes, polyesters, polyurethanes, acrylics (e.g.,polyacrylates, polymethacrylates, hereafter “poly(meth)acrylates”),epoxies, fluoropolymers, polyolefins, and co-polymer and/or combinationsthereof. In one aspect polydimethylsiloxanes,polydimethylphenylsiloxanes, polyphenylsiloxanes, or blends areemployed. Other polydialkyl-, polydialkylphenyl-,polydialkylalkylphenyl- and polyalklyphenyl-siloxane polymers can besubstituted for the above transparent matrix. Mixtures, copolymers, andblends of these siloxanes can be used. In one aspect,polydimethylsiloxane and/or polyphenylsiloxanes having sufficientpre-cure viscosities for introduction to the LED package that cure to agel and/or hard durometer layer are preferred.

The highly refractive material can be any material with a high index ofrefraction. In some embodiments, the highly refractive material can havean index of refraction of greater than about 1.8, greater than about 2,preferably greater than about 2.2, and most preferably greater than orequal to about 2.4. Suitable examples of high index of refractionmaterial can include, titanium dioxide (n=2.4), zinc oxide, berylliumoxide, zinc sulfide, barium sulfate, boron nitride, talc, silica,alumina, zeolite, calcium carbonate, magnesium carbonate, bariumsulfate, titanium oxide, aluminum hydroxide, magnesium hydroxide, mica,montmorillonite clay, carbon particles, glass particles, carbonnanotubes, and mixtures thereof. The amount of high index of refractionmaterial that can be used will at least depend, in part, on the choiceof binder material. To provide suitable reflectivity, while notnegatively affecting the viscosity and/or curing and/or dispensabilityof the reflective layer. Excess amounts of the high index of refractionmaterial may result in delaminating of the reflective layer, or lessthan ideal dispensing/dispersion of the reflective layer. Insufficientamounts of the high index of refraction material may result in reducedreflectivity of the reflective layer and lower gains in total luminousflux for the package. In some embodiments, the loading of the high indexof refraction material can be between about 3 weight percent to about 50weight percent. In other embodiments, the reflective layer can haveabout 10 to about 25 weight percentage of the high index of refractionmaterial in the binder. In still other embodiments, the reflective layercan have about 15 weight percentage of high index of refractionmaterial.

The binder material used in the reflective layer can be the same as thebinder material in the conversion material layer, and/or theencapsulant, while in other embodiments some or each can comprisedifferent materials. Different factors can dictate which binder to use,such as reliability, IR, adhesion, etc.

In some embodiments, the reflective layer can be configured with aloading so that when introduced to the LED package it has the viscosityto form at a predetermined thickness. In some embodiments, thisthickness can be less than or equal to the height of a light emittingsurface of the LED chips. The layer thickness can range from a fewmicrons to up to several hundred microns, in some embodiments an LEDpackage can have a reflective layer with different thicknesses. Thevarying thicknesses that can be intentional or can be introduced as theresult of manufacturing processes.

In some embodiments, the reflective layer can comprise one or reflectivematerials of about 2.4 IR contained in a binder of less than about 1.5IR. In one exemplary embodiment, a predetermined amount of titaniumdioxide (TiO₂) can be mixed in a clear silicone binder. Titanium dioxidecan be present in one or more forms, e.g., rutile, anatase, andbrookite. The average particle size of the titanium dioxide particles inthe transparent binder can be between about 1 nanometer (nanoparticles)to about 500 microns. In certain aspects, the size of the titaniumdioxide particles is between about 0.1 to about 10 microns, about 0.5 toabout 5 microns, or a size distribution mixture can be used.

In still other embodiments, the reflective layer can include one or moreconversion materials as discussed above. The conversion material can beincluded in the binder, for example, dispersed or distributed with thehighly reflective material. In other embodiments, the conversionmaterial can be configured in a separate layer that can be adjacent to,on and/or under the reflective layer, e.g., in a multi-layerconfiguration. In some of these embodiments, different conversionmaterials can be distributed among one or more of the multi-layers.Combinations of the above described configurations of a transparentbinder, highly reflective material, and conversion materials can beemployed. The reflective layer can also comprise thixotropic agents togive the reflective layer the desired viscosity, and can comprisediffusing materials to help disperse the reflected light. In someembodiments, scattering materials can be added to the reflective layersuch as fumed silica.

The reflective layer can be used in many different LED packages,including but not limited to, the LED package embodiments describedabove. FIGS. 144 through 147 show one embodiment of an LED package 1400that utilizes a reflective layer according to the present invention,with the LED package 1400 being similar to the LED package 50 shown inFIGS. 4 through 13 and described above. For the same or similarfeatures, the same reference numbers are used, with the understandingthat the descriptions above also apply to this embodiment. The LEDpackage 1400 comprises an LED 52, mounted on a submount 54. The LEDpackage 1400 also comprises first and second bottom contact/solder pads60 a and 60 b on the bottom of the submount 54, first and secondconductive vias 62 a, 62 b passing through the submount 54, and firstand second die attach pads 64 a, 64 b on the top surface of the submount54.

The LED package 1400 also comprises a reflective layer 1402 that isarranged the exposed surfaces of the die attach pads 64 a, 64 b, andexposed portions of the top surface of the submount 54. The LED packagefurther comprises a conversion material layer 56 covering the LED 52 andthe surface of the reflective layer around the LED 52. In thisembodiment, the reflective layer extends substantially from the edge ofthe LED chip 52 to the edge of the submount 54. The reflective layer cancomprise any of the materials and different material combinations forthe reflective layers described above. An encapsulant 58 is includedover the conversion material layer 56, and is generally cube shaped asdescribed above. The LED 52 is shown as a single LED, but it isunderstood that in other embodiments (such as those described below) thelight source can comprise more than one LED. As described above, manydifferent LEDs can be used such as those commercially available fromCree Inc., under its DA, EZ, GaN, MB, RT, TR, UT and XT families of LEDchips, among others. The LED package 50 is particularly arranged for usewith the DA family of chips such as the DA850 chip that can be flip chipmounted and allows for wire-free bonding. Other DA chips can be used,including but not limited to, DA800 (800 μm by 800 μm), DA500 or DA450.

During operation, the LED chip 52 emits LED light and the conversionmaterial layer 56 comprises a conversion material that converts the LEDlight to a different wavelength of light. As described above withreference to FIG. 17, a portion of the LED light passes through theconversion material layer 56 and experiences TIR when it reaches thesurface of the encapsulant 58. Other portions of the LED light can passout of the encapsulant 58 to contribute to emission from the LEDpackage. The LED light reflects within the encapsulant and caneventually be directed back toward the submount 54. The reflective layeris arranged such that it reflects the portion of this light that passesthrough the conversion material layer 56. Light that is not “recycled”at the conversion material layer as described above, is reflected. Theconversion material layer 56 works with the reflective layer 1402 toprovide a “blanket” effect that helps limit both LED and conversionmaterial light from re-entering the chip or hitting the submount and itsabsorbing regions. Any light that passes through the conversion materialencounters the reflective layer 1402, where it reflects back through theconversion material again. Without the reflective layer 1402, the lightcould be absorbed by the submount or the die attach pads.

The result is that the TIR, recycling and reflection from the reflectivelayer allows for further improvements in emission efficiencies.Embodiments of the present invention have reduced concentrations ofconversion material in the conversion material layer to achieve the samecolor point due to the recycling effect. In some embodiments, thescattering during recycling of the light can also provide additionaladvantages of a broader emission profile as described above.

It is understood that other embodiments can be arranged with thereflective layer on the conversion material layer, and the reflectivelayer according to the present invention can also be used in embodimentswhere the conversion material layer only covers LED chip(s). FIGS. 148through 151 show another embodiment of an LED package 1450 that utilizesa reflective layer according to the present invention, with the LEDpackage 1450 also being similar to the LED package 50 shown in FIGS. 4through 13 and described above. The LED package 1450 also comprisesfirst and second bottom contact/solder pads 60 a and 60 b on the bottomof the submount 54, first and second conductive vias 62 a, 62 b passingthrough the submount 54, and first and second die attach pads 64 a, 64 bon the top surface of the submount 54. The LED package further comprisesa conversion material layer 1452 that covers only the LED 52. Areflective layer 1454 is included on the exposed surfaces of the dieattach pads 64 a, 64 b, and exposed portions of the top surface of thesubmount 54. An encapsulant 58 is included over the LED 52, the attachpads 64 a, 64 b, and the submount 54. The above features of the LEDpackage are described in detail below. LED or conversion material lightthat experiences TIR and is directed back toward the submount 54 isreflected by the reflective layer 1454. This reduces or eliminates theamount of light that can be absorbed by the submount or the die attachpads.

It is further understood that the reflective layer can be used in LEDpackages having different encapsulant shapes as described above,including but not limited to the cube shaped encapsulants as shown inembodiment of FIGS. 43 through 46 and the combination of planar andcurved surface encapsulants as shown in the embodiment of FIGS. 119through 125 described above. FIGS. 152 through 155 show anotherembodiment of an LED package 1500 according to the present inventionhaving approximately vertical side surfaces 1502 that are approximatelyaligned with the edges of the submount 1504. This embodiment also has apolarity indicator that comprises a notch 1506 in the corner of thesolder pad 1508. The package 1500 also comprises a LED chip 1510 coatedby a conversion material layer 1512 as best shown in FIG. 154. The topsurface of the submount is coated by a reflective layer 1514 similar tothe LED package 1450, with the reflective layer 1514 also arranged toreflect light might otherwise be absorbed by the submount 1504.

FIGS. 156 through 159 show another embodiment of an LED package 1550according to the present invention that is similar to the LED package1320 shown in FIGS. 133 through 139 and described above. LED package1550 comprises an LED 1322 mounted to a submount 1324 having first andsecond contact pads 1326 a, 1326 b, first and second die attach pads1328 a, 1328 b, and vias 1330 a, 1330 b. The LED package can also have aconversion material layer 1332 and encapsulant 1334, polarity indicators1336, 1338 and an ESD chip 1340. Like some of the cubic encapsulantembodiments described above, a small encapsulant connection section 1342is included at the base of the encapsulant 1334. This is a byproduct ofthe molding process as described above. The cavities in the moldingprocess may not extend to the top surface of the submount 1324 and thecurved shape of the encapsulant may result in corner portions of thesubmount not covered by its corresponding cavity. This leaves theencapsulant section 1342 at the corners of the LED package betweenadjacent ones of the LED packages. The singulation process cuts throughthe connection section 1342 and the submount 1324 when separating theLED packages. The cavities of the molds can overlap so that during thesingulation process the planar surfaces are formed in the encapsulants.In still other embodiments, that planar surfaces can be formed in alater truncation process where the overhanging section of the lens canbe removed.

The LED package 1550 further comprises a reflective layer 1552 thatextends from the LED chip 1322 to the edge of the submount 1324. Likethe embodiments above, the reflective layer 1552 reflects light thatmight otherwise be absorbed at the submount 1324. In this embodiment,the sidewalls/edges 1556 of the LED package 1550 generally comprisethree elements, which can include the submount 1324, reflective layer1552, and the encapsulant 1334. That is, the edges of the features arealigned and are coplanar to form the sidewalls 1556 of the LED package.It is understood that other elements can also be included to form thesidewall, such as die attach pads, contact pads or ESD chips.

FIG. 160 shows another embodiment of an LED package 1570 according tothe present invention that is similar to the LED package 1550 shown inFIGS. 156 to 159, and described above. The LED package 1570 comprises anLED 1322 mounted to a submount 1324, a first contact pad 1326 a (secondcontact pad 1326 b not visible) and an encapsulant 1334. The LED package1570 further comprises a reflective layer 1572 that can comprise any ofthe materials described above, and is on the top surface of the dieattach pads and the submount 1324 and extends from the edge of the LEDchip 1322 to the edge of the submount 1324. A conversion material layer1574 can be included on the LED chip 1322 and the reflective layer 1572,with the embodiment shown having a conversion material layer 1574 thatextends to the edge of the submount 1324. The resulting LED packagestructure comprises a reflective layer 1572 arranged between conversionmaterial layer 1574 and the submount 1324.

In this embodiment, the sidewalls 1576 of the LED package 1570 generallycomprise four elements, which can include the submount 1324, reflectivelayer 1572, conversion material layer 1574 and the encapsulant 1334. Theedges of the features/elements are aligned and are coplanar to form thesidewalls 1556 of the LED package. Like the embodiment above, otherelements can also be included to form the sidewall, such as die attachpads, contact pads or ESD chips. It is also understood that differentones of the sidewalls can have different numbers of elements. Forexample, the conversion material layer and/or the reflective layer maynot extend to the edge of the submount at each sidewall. For thesesidewalls, there can be different numbers of aligned elements.

It is also understood that in other embodiments the order of theelements can be different. In some embodiments the reflective layer andconversion material layer can extend to the edge of the submount, withthe reflective layer on the conversion material layer. In theseembodiments the reflective layer is between the conversion material andthe submount. In still other embodiments, the conversion material layerand reflective layer can be provided as a single layer with theconversion material and reflective material mixed.

Other embodiments with can comprise any of the multiple LED embodimentsdescribed above. By way of example, FIGS. 161 to 164 show anotherembodiment of an LED package 1600 according to the present inventionthat is similar to the LED package 150 shown in FIGS. 20 through 27 anddescribed above. LED package 1200 comprises a submount 54, encapsulant58, solder pads 60 a, 60 b and conductive vias 62 a, 62 b. In thisembodiment, the light source comprises first and second LEDs 152 a, 152b mounted to first and second die attach pads 154 a, 154 b on thesubmount. The LEDs 152 a, 152 b can comprise many different commerciallyavailable LEDs such as those described above, with some embodimentsutilizing DA350 LEDs commercially available from Cree, Inc. The LEDs 152a, 152 b can have different dimensions, with some embodiments beingapproximately 350 μm by 470 μm. Other embodiments can use different DAchips such as DA320 chip (320 μm by 420 μm) or a single DA450 chip (450μm by 450 μm).

The die attach pads 154 a, 154 b can be made of the same materials asdescribed above and can be deposited using the same methods. The LEDs152 a, 152 b can be mounted in different locations on attach pads 154 a,154 b, with the first LED 152 a mounted generally in one corner of thesubmount 54, and the second LED mounted at the opposite corner of thesubmount 54. During operation, an electrical signal is applied to thesolder pads 60 a, 60 b that is transmitted to the attach pads 154 a, 154b through the vias 62 a, 62 b. The signal is then transmitted to theLEDs 152 a, 152 b causing them to emit light. The LED package operatesin much the same way as LED package 50, and can have the same sizes andratios described above.

In LED package 1600 the LEDs 152 a, 152 b are covered by a conversionmaterial layer 1602. The space between the LEDs 152 a, 152 b is coveredby a reflective layer 1604, and like the embodiments above thereflective layer 1404 can extend to the edge of the submount and can bearranged to reflect LED light that might otherwise be absorbed at thesubmount 54. It is understood that this is only one the different LEDpackages with multiple LEDs that can utilize a reflective layeraccording to the present invention.

FIG. 165 shows a graph 1650 with first and second test samples 1652 and1654 showing improvement in the luminous flux for the LED packageshaving reflective layers according to the present invention and similarLED packages that do not. The first test sample 1652 has a lens of afirst size and shows in increase in luminous flux of approximate 2% forLED packages having a reflective layer compared to those that do not.The second test sample 1654 shows similar improvement results for a lensof a second size.

The different embodiments of the present invention can emit with lightwith different characteristics and with different emission intensitiesdepending on the different LED package arrangements and features. Someembodiments of a packages according to the present invention can emitlight of light of 500 lumens with a drive signal 1500 ma. These packagescan take different sizes, with some being approximately in 2.45 mmsquared. The LED package can also operating at different temperaturessuch as 25° C. Still other embodiments can emit 175 lumens per wattefficacy at 1 W, with the LED package operating at different temperaturesuch as 25° C. Still other embodiments can operate up to 499 lumens witha drive signal 5 W and a temperature of 85° C. The LED package can emitcolor temperatures ranging from 2700K to 8300K and have a colorrendering index in the range of 50 to 97.

The LED packages according to the present invention can be manufactureusing many different methods. In some embodiments, the LED packages canbe provided in a in a panel format so that a plurality of the LEDpackages can be processed simultaneously. FIG. 166 shows a panel of LEDpackage 1700 prior to deposition of the reflective layer and prior toformation of the encapsulant. FIG. 167 shows the same panel of LEDpackages 1700, with reflective layer 1702 arranged around each of theLED chips and to the edge of each package's submount. The reflectivelayer can be deposited using many different processes, with a suitableprocess being flowing or dispensing of the reflective material in a gridbetween the chips and allowing the reflective material to spread to fillthe space between the chips. The reflective material can then be curedand the encapsulant can be formed over the LED chips. The packages canthen be singulated. In some embodiments, the reflective layer materialcan only be partially cured and then the encapsulant can be formed overthe packages. This can result in crosslinking or bonding of thereflective layer material to the encapsulant to provide a more reliableLED package.

It is also understood that in some embodiments, the reflective materialcan be applied to less than all of the elements on the top surface ofthe submount. FIG. 168 shows another panel 1750 of LED packages 1752. Inthis embodiment, a reflective layer 1754 is included on only a portionof the submount, with the reflective layer as shown only covering theESD chip. This can improve efficiency by eliminating or reducingabsorption at the ESD chip, but the remainder of the submount may absorblight.

FIGS. 169 and 170 show images of an LED package 1800 manufacturedaccording to the present invention, that is similar to the LED package1550 shown in FIGS. 156 to 159. The LED package 1800 comprises an LEDchip, submount 1324, reflective layer 1552 and encapsulant 1334. Asdescribed above, the sidewalls of the LED package 1800 generallycomprise three elements, which can include the submount 1324, reflectivelayer 1552, and the encapsulant 1334. That is, the edges of the featuresare aligned and are coplanar to form the sidewalls of the LED package.As described above, other LED package embodiments can have more or fewerelements that form their sidewalls.

Although the present invention has been described in detail withreference to certain preferred configurations thereof, other versionsare possible. The invention can be used in any light fixtures where auniform light or a near uniform light source is required. In otherembodiments, the light intensity distribution of the LED module can betailored to the particular fixture to produce the desired fixtureemission pattern. Therefore, the spirit and scope of the inventionshould not be limited to the versions described above.

We claim:
 1. An emitter package, comprising: one or more of solid statelight sources on a surface of a submount; a reflective layer on samesurface of said submount; an encapsulant over said one or more solidstate light sources, wherein an edge of said submount, said reflectivelayer and said encapsulant form at least a portion of an edge of saidpackage.
 2. The emitter package of claim 1, wherein said edges of saidsubmount, said reflective layer and said encapsulant are aligned.
 3. Theemitter package of claim 1, wherein said edges of said submount, saidreflective layer and said encapsulant are coplanar.
 4. The emitterpackage of claim 1, wherein said reflective layer comprises a dielectricmaterial.
 5. The emitter package of claim 1, wherein said reflectivelayer comprises titanium dioxide particles.
 6. The emitter package ofclaim 1, wherein said reflective layer is white.
 7. The emitter packageof claim 1, wherein said reflective layer is white paint.
 8. The emitterpackage of claim 1, further comprising a conversion material.
 9. Theemitter package of claim 1, further comprising a conversion materiallayer on said one or more light sources.
 10. The emitter package ofclaim 9, wherein an edge of said conversion material layer forms atleast a part of said edge of said package.
 11. The emitter package ofclaim 1, wherein said encapsulant includes planar surfaces.
 12. Theemitter package of claim 1, wherein said encapsulant comprises curvedsurfaces.
 13. An emitter package, comprising: one or more of solid statelight sources on a surface of a submount; a reflective layer on samesurface of said submount from the edges of said light sources toward theedge of said submount; an encapsulant over said one or more solid statelight sources, said reflective layer and said submount, said encapsulanthaving one or more planar surfaces.
 14. The emitter package of claim 13,wherein said reflective layer extends to said edge of said submount. 15.The emitter package of claim 13, wherein said reflective layer comprisesa binder and a high refractive index material.
 16. The emitter packageof claim 13, wherein said submount comprises a length and width and saidencapsulant has a curved surface with a radius of curvature greater thanhalf of said submount length and/or width.
 17. The emitter package ofclaim 13, wherein said encapsulant is cubic.
 18. The emitter package ofclaim 13, further comprising a conversion material layer over at leastone of said one or more of solid state light sources
 19. The emitterpackage of claim 18, wherein said conversion material layer is only onone of said solid state light sources.
 20. The emitter package of claim18, wherein said conversion material layer is also on said submount,said conversion layer material between said reflective layer and saidsubmount.
 21. The emitter package of claim 18, wherein said conversionmaterial layer is on said submount, said reflective layer between saidconversion layer material and said submount.
 22. The emitter package ofclaim 13, wherein said one or more of solid state light sourcescomprises a light emitting diode.
 23. The emitter package of claim 13,wherein said one or more solid state light sources comprises a pluralityof light emitting diodes.
 24. An emitter package, comprising: one ormore light emitting diodes (LEDs) on a surface of a submount; aconversion material layer over said LEDs; and a reflective layer on saidsurface of said submount and covering substantially all of said surfacenot covered by said one or more LEDs.
 25. The emitter package of claim24, wherein said reflective layer comprises a binder and a highrefractive index material.
 26. The emitter package of claim 24, whereinsaid submount comprises a length and width and said encapsulant has acurved surface with a radius of curvature greater than half of saidsubmount length and/or width.
 27. The emitter package of claim 24,wherein said encapsulant is cubic.
 28. The emitter package of claim 24,wherein said conversion material layer is also on said submount, saidconversion layer material between said reflective layer and saidsubmount.
 29. The emitter package of claim 24, wherein said conversionmaterial layer is on said submount, said reflective layer between saidconversion layer material and said submount.
 30. The emitter package ofclaim 24, wherein said one or more LEDs comprises a plurality of LEDs.31. The emitter package of claim 24, wherein said submount has a squarefootprint.
 32. The emitter package of claim 24, wherein said submounthas a footprint area of less than 12 mm square.
 33. The emitter packageof claim 24, wherein said submount has a footprint area in the range of1 to 4 mm square.
 34. An emitter package, comprising: one or more LEDsmounted on a submount; reflective layer on the top of said submount notcovered by said LEDs; an encapsulant on said submount, wherein saidencapsulant comprises a curved upper surface and one or more planar sidesurfaces having a curved edge.
 35. The emitter package of claim 34,wherein said reflective layer extends to the edge of said submount. 36.The emitter package of claim 34, wherein said reflective layer coverssubstantially all of said the top of said submount not covered by saidLEDs.
 37. The emitter package of claim 34, wherein at least one of saidplanar side surfaces are vertical.
 38. The emitter package of claim 34,wherein at least one of said planar side surfaces is orthogonal to thetop surface of said submount.
 39. The emitter package of claim 34,wherein said curved surface comprises a radius of curvature greater thanhalf of said submount length and/or width.